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Design and manufacturing method of a ceramic wall structure based on to-shaped end seals

A manufacturing method and end-sealing technology, which are used in the manufacture of semiconductor/solid-state devices, semiconductor/solid-state device components, and semiconductor devices, etc., can solve the problem of low air-tightness of the tube and shell, micro-cracks in ceramic walls, and easy deformation of end-sealing holes, etc. problems, to achieve the effect of improving pressure resistance and impact resistance, facilitating mass production and low production cost

Active Publication Date: 2020-08-11
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes a design and manufacturing method based on a TO-type end-sealed tube-shell ceramic wall structure. Its purpose is to solve the problems of easy deformation of ceramic end-sealed holes, accumulation of slurry on the hole wall, and concentrated stress release in the production process of the prior art. , micro-cracks in the ceramic wall, low air tightness and poor reliability of the shell, and other defects are redesigned and manufactured. Through structural design, an end-sealed shell ceramic that ensures the strength of the ceramic itself and meets the electrical performance assessment requirements of the shell is provided. wall structure design

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  • Design and manufacturing method of a ceramic wall structure based on to-shaped end seals

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specific Embodiment 1

[0044] A design based on a TO-type end-sealed shell-and-tube ceramic wall structure, using 98wt% alumina raw ceramics, a closed entity with a metallized connecting rib pattern width of 0.8mm, and a design of end-seal hole diameter of 1.35mm. The design is 3.7mm, and the overall dimension is designed to be 12.7mm in length and 2.6mm in width.

[0045] A method for manufacturing ceramic wall structures based on TO-type end-sealed tubular shells includes the following manufacturing steps:

[0046] 1) Make a screen with a photosensitive film thickness of 10 μm and an opening ratio of 40%, and use a multi-layer ceramic alumina printing process to control the metallization paste to a thickness of 10 μm to realize the production of metallized rib graphics.

[0047] 2) Use an ultraviolet or fiber laser with an output power of 10W and a spot diameter of 0.1mm to process a 1.4mm-diameter end-sealed hole on an alumina green ceramic sheet. The ultraviolet laser processing parameters pulse...

specific Embodiment 2

[0051] A design based on a TO-type end-sealed shell-like ceramic wall structure uses 95wt% alumina raw ceramics, and the width of the metallized connecting rib is designed to be a closed entity of 0.9mm. The diameter of the end-sealed hole is designed to be 1.5mm, and the hole pitch is designed is 3.81mm, and the overall dimension is designed to be 13mm in length and 3mm in width.

[0052] A method for manufacturing ceramic wall structures based on TO-type end-sealed tubular shells includes the following manufacturing steps:

[0053] 1) Make a screen with a photosensitive film thickness of 13 μm and an opening ratio of 65%, and use a multi-layer ceramic alumina printing process to control the metallization paste to a thickness of 15 μm to realize the production of metallized rib graphics.

[0054] 2) Use an ultraviolet laser with an output power of 10W and a spot diameter of 0.02mm to process holes with a diameter of 1.5mm on the alumina green ceramic sheet. The parameters of ...

specific Embodiment 3

[0058] A design based on a TO-type end-sealed shell-like ceramic wall structure uses 92wt% alumina raw ceramics, and the width of the metallized connecting rib is designed to be a closed entity of 1.5mm. The diameter of the end-sealed hole is designed to be 1.56mm, and the hole pitch is designed is 3.9mm, and the overall dimension is designed to be 13.2mm in length and 3.1mm in width.

[0059] A method for manufacturing ceramic wall structures based on TO-type end-sealed tubular shells includes the following manufacturing steps:

[0060] 1) Make a screen with a photosensitive film thickness of 30 μm and an aperture ratio of 70%, and use a multi-layer ceramic alumina printing process to control the metallization paste to a thickness of 50 μm to realize the production of metallized rib graphics.

[0061] 2) Use an ultraviolet laser with an output power of 20W and a spot diameter of 0.2mm to process holes with a diameter of 1.56mm on the alumina green ceramic sheet. The processin...

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Abstract

The invention relates to a ceramic wall structure design based on a TO-type end-sealed tube shell, including high-temperature alumina co-fired ceramic sheets, ceramic end-sealed holes, metallized rib graphics, stress relief grooves, and metallized side wall printing. The ceramic wall end seal area is provided with metallized rib graphics, and at the same time, stress relief grooves are made before sintering to achieve the purpose of step-by-step uniform solder flow during the metal-ceramic brazing process. The manufacturing method includes making metallized graphic connecting ribs, making ceramic end-sealed holes without deformation, making ceramic end-sealed hole walls without slurry accumulation, and making stress relief grooves. Advantages: 1) Effectively solve defects such as poor mechanical properties of the shell, difficulty in ensuring air tightness, easy deformation of the end sealing hole, easy accumulation of solder, and cracks on the wall of the end sealing hole; 2) Significantly improve the current withstand voltage and impact resistance of the tube and shell, while It meets the requirements of high current carrying capacity and high voltage resistance; 3) The processing and forming method is simple, the production cost is low, and it is convenient for mass production.

Description

technical field [0001] The invention relates to a design and manufacturing method of a ceramic wall structure based on a TO-type end-sealed tube shell, and belongs to the technical field of semiconductor manufacturing. Background technique [0002] The TO (Transistor Outline Transistor Outside) type shell ceramic wall structure integrates multiple copper-clad composite pin welding areas on a ceramic chip using a multi-layer ceramic process, which can well replace glass insulators and meet high power density electronic components. need. There are two types of ceramic wall structure design based on this type of TO shell transmission end: sleeve seal structure and end seal structure. At present, most of the designs adopt the sleeve-sealed structure, which has low reliability, is easy to crack, and is expensive and difficult to manufacture, so it is not suitable for batch production; a small number of designs adopt the end-sealed structure, and there is excessive residual stres...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/04H01L23/08H01L21/48
CPCH01L21/4807H01L21/4817H01L23/04H01L23/08
Inventor 莫仲陈宇宁陈寰贝龚锦林
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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