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Packaging method and equipment for micron-scale glass etching model

A packaging method and packaging equipment technology, applied in the direction of microstructure devices, manufacturing microstructure devices, decorative arts, etc., can solve the problem of inability to match micron-scale glass etching models, meet packaging requirements of micron-scale glass etching models, and restrict glass Etching the progress of the model scale and other issues to achieve the effect of reliable packaging process, ensuring accuracy and reliability, and improving the success rate

Active Publication Date: 2020-10-09
PETROCHINA CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, none of the packaging methods in the prior art can meet the packaging requirements of the micron-scale glass etching model, and cannot match the micron-scale glass etching model, which seriously restricts the progress of the glass etching model on the scale

Method used

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  • Packaging method and equipment for micron-scale glass etching model
  • Packaging method and equipment for micron-scale glass etching model
  • Packaging method and equipment for micron-scale glass etching model

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Embodiment Construction

[0070] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0071] Embodiment 1 of the present invention provides a specific implementation of a packaging method for a micron-scale glass etching model, see figure 1 , the encapsulation method of the micron-scale glass etching model specifically includes the following contents:

[0072] Step 100: Apply a preset spin coating method to form an adhesive layer ...

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Abstract

The embodiment of the invention provides an encapsulation method and an apparatus for a micron-level glass etching model. The encapsulation method comprises the following steps: an adhesive layer is formed on the encapsulation glass sheet by a preset spin coating method, and the thickness value at the thickest part of the adhesive layer is smaller than the width value at the narrowest part of thepore channel in the micron-level glass etching model; and the micron-scale glass etching model overlaid on the adhesive layer so that a surface of a channel of the micron-scale glass etching model isbonded with the encapsulation glass sheet. The invention can realize the encapsulation of the micron-level glass etching model, and the encapsulation process is convenient, reliable and high in efficiency.

Description

technical field [0001] The invention relates to the technical field of oilfield development, in particular to a packaging method and equipment for a micron-scale glass etching model. Background technique [0002] In the reservoir physical simulation experiment, the glass etching model is a commonly used research model. Usually, regular or simulated channels and pores are etched on the surface of the glass sheet, and the sheet-shaped glass etching model is packaged, and the flow of the fluid in it is observed after packaging. It has irreplaceable advantages in seepage mechanism, fluid action mechanism and fluid-solid coupling effect. In order to achieve the closeness between the simulation of the real pores and the etched channels in scale, it is necessary to use the laser sputtering etching method to etch the micron-scale glass etching model on the surface of the quartz glass sheet, in which the micron-scale glass etching model The width of the channel can reach the micron...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
CPCB81C1/00119B81C1/00261B81C1/00388B81C1/00523
Inventor 陈兴隆姬泽敏俞宏伟李实韩海水
Owner PETROCHINA CO LTD
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