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Multi-layer board interlayer offset detection method and detection system

An offset detection, multi-layer board technology, applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problems of long detection time, inaccurate detection results, etc., to achieve small offset of each layer, avoid Effects of mutual interference and high measurement accuracy

Active Publication Date: 2018-11-30
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for detecting offset between layers of multi-layer boards, so as to solve the technical problems of long detection time and inaccurate detection results existing in existing offset detection methods

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  • Multi-layer board interlayer offset detection method and detection system
  • Multi-layer board interlayer offset detection method and detection system
  • Multi-layer board interlayer offset detection method and detection system

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Embodiment Construction

[0062] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0063] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly located on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. The indicated orientation or position is based on the orientation or position shown in the drawings, and is only for conv...

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Abstract

The invention relates to the technical field of printed circuit board manufacturing, and provides a multi-layer board interlayer offset detection method and detection system. The multi-layer board interlayer offset detection method comprises the steps that an interlayer offset system is designed, specifically, one layer of a multi-layer circuit board is selected as a datum layer, other layers of the multi-layer circuit board are used as test layers, a datum graph is arranged on a preset position of a datum layer work board provided with the datum layer, test graphs are arranged on preset positions of test layer work boards provided with the test layers, and the test graphs of the test layers are mutually staggered; an interlayer offset system is made, specifically, the datum layer and thetest layers in the multi-layer circuit board are made, the datum graph is made on the datum layer work board, and the test graphs are made on the test layer work boards; and interlayer offsets are detected, specifically, the position of the finished datum graph of the multi-layer circuit board is obtained, the distance between each test graph on each corresponding test layer and the datum graph ismeasured, the distances are compared with designed distance, and the interlayer offset of each test layer is obtained. The higher measurement accuracy is achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, and more specifically, relates to a method and a detection system for interlayer offset detection of multilayer boards. Background technique [0002] As the printed circuit board (PCB for short) develops toward high density, the structure of the multilayer circuit board is the most commonly used type. Each layer of a multilayer circuit board is composed of an upper layer of copper foil, a lower layer of copper foil and an insulating layer located in between. The materials of each layer are combined with semi-cured glue as an adhesive to combine. Among them, the copper foils of each layer are not connected. In order to connect some or specific parts of the lines of each layer, it is necessary to form a through hole by drilling, and then electroplate the through hole to make the inner wall of the through hole and the multilayer An electroplating layer of appropriate thi...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4638
Inventor 邝美娟付凤奇张霞王俊
Owner SHENZHEN KINWONG ELECTRONICS
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