Heat dissipating fin and installation method thereof

Abstract

The invention discloses a heat dissipating fin, comprising a heat dissipating plate and a plurality of conductive foams 1 and conductive foams 2, wherein two sides of the bottom of the heat dissipating plate are provided with symmetric conductive foams 1, and the other two sides of the bottom of the heat dissipating plate are provided with symmetrical conductive foams 2; the four ends of the corners of the heat dissipating plate are provided with mounting holes, and the mounting holes are provided with sleeves in a sleeving manner, the sleeves fixedly connect the heat dissipating plate with external equipment through fasteners, one side of the heat dissipating plate is provided with a through hole, the upper portion of the through hole is provided with a clamp slot 1 extending to the inside of the through hole, the clamp slot 1 is internally fastened with a thermal conductive silica gel matched with the clamp slot 1, and the thermal conductive silica gel penetrates through the throughhole and is matched with the through hole.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to a heat sink and an installation method thereof. Background technique [0002] Generally, the heat sink should be coated with a layer of heat-conducting silicone grease on the contact surface between the electronic components and the heat sink during use, so that the heat emitted by the components can be more effectively transferred to the heat sink, and then dissipated into the surrounding air through the heat sink. The bottom of the heat sink is pasted with conductive foam, but most of the conductive foam on the market is an integrated structure, which makes it inconvenient to splice and disassemble the conductive foam, and it is not convenient for the conductive foam to fill the gap, conduct electricity and bond. The use of integrated conductive foam is easy to cause waste of resources when cutting, and it is not conducive to partial replacement. Moreover, it is easy to form...

AI Technical Summary

Problems solved by technology

The bottom of the heat sink is pasted with conductive foam, but most of the conductive foam on the market is an integrated structure, which makes it inconvenient to splice and disassemble the conductive foam, and it is not convenient for the conductive foam to fill the gap, conduct electricity and bond. The use of integrated conductive foam is easy to cause waste of resources when cutting, and it is not conducive to partial replacement. Moreover, it is easy to form high temperature after long-term use, which makes it easy to deform when used at high temperature for a long time, thus affecting the conductive foam. Cotton shielding

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