Micro laser auxiliary machining system for optical hard and brittle material and use method thereof

Abstract

The invention belongs to the workpiece machining related technical field and discloses a micro laser auxiliary machining system for optical hard and brittle material and a use method thereof. The micro laser auxiliary machining system comprises a laser generator, a shell and a machining cutter. The laser generator is arranged at one end of the shell. The machining cutter is connected to the otherend of the shell and comprises a front cutter face and a rear cutter face which are connected. A cutting edge is formed on the transition part between the front cutter face and the rear cutter face. The laser generator is used for emitting a laser beam. The laser beam penetrates through the shell, then is sent to the machining cutter and is sent out from the cutting edge and at least one of the front cutter face and the rear cutter face, and the sent-out laser beam radiates onto a to-be-machined workpiece so as to soften the workpiece. According to the micro laser auxiliary machining system for the optical hard and brittle material and the use method thereof, laser and single-point turning processes are combined, cost is lowered, efficiency is improved, and service life of the cutter is prolonged.

Description

technical field [0001] The invention belongs to the technical field related to workpiece processing, and more specifically relates to a micro-laser assisted processing system for optically hard and brittle materials and a method for using the same. Background technique [0002] In recent years, it is very popular to process materials that are difficult to process by traditional methods by micro-laser assisted processing, and there are more and more related researches. These methods mainly cause the softening of the workpiece material and promote the processing of the workpiece by applying heat to the workpiece, and only the part to be processed of the workpiece material is affected by the heat, and the remaining part of the workpiece will not be damaged. Most of the existing micro-laser-assisted processing methods require that the laser and the processing tool be placed separately, that is, the laser radiation is used to heat and soften the workpiece before the tool contacts...

AI Technical Summary

Problems solved by technology

Due to the high hardness, brittle characteristics and poor machinability of single crystal silicon, it is very difficult to process silicon without causing surface and subsurface damage, and the processing of silicon is mainly affected by higher processing costs and lower product reliability Limitations, where the high cost is mainly due to expensive tools, fast tool wear, long processing time, low production efficiency and difficulty in processing high surface roughness and surface topography

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