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A method for preparing a mask, a mask, and evaporation equipment

A mask plate and evaporation technology, which is applied in the fields of array substrates, display panels and display devices, can solve the problems that it is difficult to reduce the shadow of evaporation, affect the evaporation effect of OLED panels, and reduce the display quality of OLED panels, etc. Small color mixing risk, improved display yield, reduced evaporation shadow effect

Active Publication Date: 2021-01-15
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the mainstream production method of OLED panels is to use mask plate evaporation, but there is an evaporation shadow effect when using mask plate evaporation, which seriously affects the evaporation effect of OLED panels and reduces the display quality of OLED panels.
[0003] In the prior art, fine metal mask (Fine Metal Mask, FMM) is difficult to reduce the evaporation shadow due to the limitation of the manufacturing process. When the mask plate prepared by this method is evaporated, the evaporation shadow can be reduced, and the display quality of the OLED panel can be improved.

Method used

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  • A method for preparing a mask, a mask, and evaporation equipment
  • A method for preparing a mask, a mask, and evaporation equipment
  • A method for preparing a mask, a mask, and evaporation equipment

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preparation example Construction

[0047] In order to reduce the shadow effect of vapor deposition, an embodiment of the present invention proposes a method for preparing a mask plate. The preparation method of the mask plate includes: forming a transition mask plate; performing electrolytic polishing on the transition mask plate to obtain a final mask plate, the thickness of the final mask plate is smaller than the thickness of the transition mask plate .

[0048]The preparation method of the mask plate proposed in the embodiment of the present invention, by performing electrolytic polishing on the transition mask plate, the thickness of the final mask plate obtained is smaller than the thickness of the transition mask plate, and the thickness of the mask plate is directly related to the evaporation It is related to the plating shadow effect. The larger the thickness, the more serious the evaporation shadow effect. Therefore, compared with the transition mask, the evaporation shadow effect of the thinner final...

no. 1 example

[0051] figure 2 It is a schematic diagram of the method for preparing a mask plate according to the first embodiment of the present invention. The method includes:

[0052] forming a transition mask;

[0053] Electrolytic polishing is performed on the transitional mask to obtain a final mask, and the thickness of the final mask is smaller than the thickness of the transitional mask.

[0054] In this embodiment, the transition mask includes a first surface facing the evaporation source and a second surface facing the substrate to be evaporated, and the transition mask is provided with a plurality of through holes, therefore, in In this embodiment, the preparation method of the mask plate specifically includes:

[0055] S11: forming a transition mask, the transition mask includes a first surface facing the evaporation source and a second surface facing the substrate to be evaporated, and the transition mask is provided with a plurality of through holes;

[0056] S12: Form a...

no. 2 example

[0082] Figure 7 It is a schematic structural view of the transition mask formed in the second embodiment of the present invention. The difference from the first embodiment is that in the second embodiment, the opening 23 has a platform portion 231 adjacent to the second surface 22. In the direction from one side 21 to the second side 22, the cross-sectional area of ​​the platform portion 231 is equal or gradually increases, so that the cross-sectional area of ​​the end of the platform portion 231 close to the first surface 21 defines the area of ​​the vapor deposition opening of the hole. . Meanwhile, in this embodiment, the protective layer covers the inner surface of the opening and the first surface, and the second surface is exposed.

[0083] from Figure 7It can also be seen from the figure that the opening 23 also includes an opening 232 adjacent to the first surface 21. From the first surface 21 toward the second surface 22, the cross-sectional area of ​​the opening ...

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Abstract

The invention discloses a preparation method of a mask plate, a mask plate and vapor deposition equipment. The preparation method includes: forming a transitional mask; performing electrolytic polishing on the transitional mask to obtain a final mask, and the thickness of the final mask is smaller than that of the transitional mask. When using this method to prepare a mask, the thickness of the final mask obtained is smaller than the thickness of the transition mask by performing electrolytic polishing on the transition mask, thereby reducing the risk of color mixing of adjacent pixels and improving the efficiency of the mask. The film thickness uniformity of the effective display area effectively improves the display yield of the OLED panel. At the same time, the preparation method of the mask plate proposed by the present invention reduces the thickness requirement of the mask plate raw material, reduces the difficulty of making the mask plate to a certain extent, and reduces the manufacturing cost of the mask plate. The invention also discloses a mask plate prepared by the method and evaporation equipment comprising the mask plate.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a display panel and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) panels have the advantages of self-illumination, bright colors, low power consumption, wide viewing angle, etc., and have become mainstream products in the display field. At present, the mainstream production method of OLED panels is to use mask plate evaporation, but there is evaporation shadow effect when using mask plate evaporation, which seriously affects the evaporation effect of OLED panels and reduces the display quality of OLED panels. [0003] In the prior art, it is difficult to reduce the evaporation shadow due to the limitation of the manufacturing process of the fine metal mask (Fine Metal Mask, FMM). When the mask plate prepared by the method is evaporated, the evaporation shadow can be reduced, and the display quality of the OLED pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/04H01L51/56C23C14/24C25F3/16
CPCC23C14/042C23C14/24C25F3/16H10K71/166
Inventor 徐倩张微嵇凤丽
Owner BOE TECH GRP CO LTD
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