T-type heat dissipation device applied to computer

Abstract

The invention discloses a T-type heat dissipation device applied to a computer, and relates to the technical filed of computer heat dissipation devices. The T-type heat dissipation device comprises amainboard, wherein the mainboard is provided with a CPU (Central Processing Unit); the upper part of the CPU is connected with a main radiator; a plurality of heat conduction pipes are arranged in themain radiator; the upper parts of the other ends of the plurality of heat conduction pipes are provided with an auxiliary radiator; and the auxiliary radiator comprises a first cooling fin and a second cooling fin, wherein a gap is formed between the first cooling fin and the second cooling fin. The device has the beneficial effects that the temperature of the CPU can be greatly lowered, and theradiators realize quick cooling under a situation that a heat dissipation air quantity is not increased.

Description

technical field [0001] The invention relates to the technical field of computer cooling devices, in particular to a T-shaped cooling device applied to computers. Background technique [0002] With the development of new technologies such as cloud computing and big data, the requirements for data computing speed and demand are getting higher and higher, and the computing speed and amount of computing of processors are also increasing, resulting in the temperature of memory, hard disk and other components. Constantly soaring, especially the power consumption of the CPU is increasing by 80% every year. The heat dissipation of electronic devices has become a very burning problem at present, and the society's requirements for power consumption are getting higher and higher. Energy saving is the current a major trend. [0003] How to effectively solve the problem of high temperature of various electronic components should not at least simply increase the air volume, but should re...

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Problems solved by technology

[0004] For the computer type, of course, it is better to place a CPU with higher performance, but a high-performance CPU faces a big problem, the higher the performance of the CPU, the higher the power consumption, how to effectively reduce the temperature of the CPU Within the scope of its corresponding specification requirements, although there are various radiators in the prior art, most of them only increase the cooling air volume, and cannot use devices other than radiators to cool down the radiator and CPU

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