Monitoring method and system of SMT production process

Abstract

The application discloses a monitoring method and system of an SMT production process, relates to the technical field of SMT production, and is capable of freely reading the process of surface mounting and realizing intelligence of surface-mounted production. The method includes steps: when a first production preparation instruction transmitted by a terminal device is received, a display signal istransmitted to a display on a material tray slot position corresponding to a to-be-mounted material tray on a material temporary storage rack; material parameters of the material tray are input through the terminal device, and a material tray residual production quantity set value input through the terminal device is received; the mounting condition fed back by an inductor is received in real time, the in-production quantity and the residual production quantity of the material trays in the mounting condition are analyzed, and the in-production quantity and the residual production quantity aredisplayed according to the material parameters; and when the residual production quantity is less than the material tray residual production quantity set value, the display signal is transmitted to the display on the material tray slot position corresponding to the to-be-mounted material tray and a prompt signal is transmitted to the terminal device.

Description

technical field [0001] The present application relates to the technical field of SMT production, in particular to a method and system for monitoring the SMT production process. Background technique [0002] At present, when the existing SMT placement machine is combined with the control computer to complete the production of the placement material, the material tray to be placed is placed in the feeding table of the placement machine by the material staff, and then the material tray in the feeding table However, when the material tray is placed on the material shelf, the operator manually selects the material tray on the material shelf according to the content of the BOM table, and the placement machine cannot monitor the systematic monitoring of the production process during the production process The real-time consumption of the machine needs to be completely relied on human monitoring to determine whether to refill the placement machine. In this case, artificially sel...

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Problems solved by technology

[0003] In view of this, this application provides a method and system for monitoring the SMT production process, the main purpose of which is to solve the problem that the placement progress on the placement machine cannot be monitored in the current electronic material placement management and production process, and only rely on the manual work of the material staff. Monitoring will affect the placement progress and material error rate. It cannot guarantee that all placement machines can achieve fully automatic placement. At the same time, it can automatically prompt and guide employees to supply materials to the placement machine in real time to prevent employees from making mistakes. Chip machine material supply problem

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