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Memory chip, memory device and memory system comprising same device

A memory chip and memory device technology, applied in the field of memory systems, can solve the problems of the power supply voltage of memory cell arrays and peripheral circuits that cannot be realized, and achieve the effect of reducing size and eliminating side effects

Inactive Publication Date: 2018-10-23
TSP GLOBAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] For this reason, the authorized existing invention has the published patent No. 10-2004-0000880 (invention name: power supply voltage supply method of storage device and cell array power supply voltage supply circuit), but only through the existing technology, then in There are limitations that cannot be realized by supplying the power supply voltage to the memory cell array and peripheral circuits independently

Method used

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  • Memory chip, memory device and memory system comprising same device
  • Memory chip, memory device and memory system comprising same device
  • Memory chip, memory device and memory system comprising same device

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Embodiment Construction

[0025] Hereinafter, a preferred embodiment will be described in detail with reference to the accompanying drawings, so that those skilled in the art of the present invention can implement the present invention. However, in describing a preferred embodiment of the present invention in detail, if it is judged that the detailed description of related known functions or structures may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, in all the drawings, the same reference numerals are assigned to parts that perform similar functions and actions.

[0026] Furthermore, throughout the specification, when it is indicated that a certain part is "connected" to other parts, this means not only the case of "direct connection" but also the case of "indirect connection" by interposing other devices. And, as long as there is no particular statement to the contrary, "comprising" a certain structural element means that other struct...

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Abstract

The present application relates to a memory chip in which a power voltage is independently supplied to a memory cell array and a peripheral circuit, a memory device and a memory system comprising thesame device. A memory device according to an embodiment of the present invention comprises: at least one memory chip comprising a memory cell array consisting of an array of memory cells and a peripheral circuit which is positioned around the memory cell array and in which a power line electrically independent from the memory cell array is formed; and a power voltage supply for supplying a power voltage to the memory cell array and the peripheral circuit, wherein the power voltage supply independently supplies the power voltage to each of the memory cell array and the peripheral circuit.

Description

technical field [0001] The present application relates to a memory chip, a memory device, and a memory system including the memory device that independently supply power supply voltages to a memory cell array and peripheral circuits. Background technique [0002] With the development of storage technology, storage devices are becoming more and more integrated, and performance needs to be improved. To this end, it is necessary to develop storage devices that can reduce the size of the storage chip by improving the design of the storage chip and can work faster with the same power. chip. [0003] Conventionally, one power supply voltage is supplied from the outside of the memory chip, and a power supply voltage for the memory cell array (VDDA) and a power supply voltage for peripheral circuits (VDDP) are generated and used within the memory chip by a separate internal power supply voltage generating circuit. figure 1 is a diagram showing the structure of a conventional storag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C5/14G11C5/04G11C11/4074G11C16/30G06F13/16
CPCG06F13/16G11C5/04G11C11/4074G11C16/30G11C5/147G06F13/1668G06F1/3275Y02D10/00G06F1/266G06F3/061G06F3/0659G06F3/0679
Inventor 姜尙锡崔昌铸李宣咏李进锡
Owner TSP GLOBAL CO LTD
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