Optical module and communication device

Abstract

The invention discloses an optical module and a communication device. The optical module comprises: an upper casing, a lower casing, an optical port and an electric port. The upper casing and the lower casing form a receiving cavity for housing the optical port and the electric port. The optical module further includes: a first magnetic ring disposed in the receiving cavity and located at the optical port or the electric port, wherein the magnetic field direction of the first magnetic ring is opposite to the magnetic field direction of the magnetic field induced by electromagnetic waves. The EMC problem of the optical module can be effectively and simply improved just by one first magnetic ring. The electromagnetic energy inside or outside the optical module firstly passes through the first magnetic ring when radiating outwards or radiating towards to the inside of the optical module, so that the relative magnetic permeability at the optical port or the electric port decreases. Thus, electromagnetic wave energy decreases when the internal electromagnetic energy radiates outwards and the external electromagnetic energy radiates towards the inside of the optical module, thereby reducing the electromagnetic energy radiation around the optical module, preventing the external electromagnetic energy from radiating towards the inside of the optical module, and further optimizing the EMC characteristics of the optical module and reducing electromagnetic interference.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical module and communication equipment. Background technique [0002] In the field of optical communication technology, EMC (Electro Magnetic Compatibility, electromagnetic compatibility) refers to the performance of a device that can work normally in its own environment without causing strong electromagnetic interference to any other devices in the environment. With the increase of density and distribution of operators, the requirements for EMC of optical modules are getting higher and higher. [0003] When the electrical and electronic equipment in the optical module is working, there will be intermittent or continuous voltage and current changes, and sometimes the rate of change is quite fast, resulting in electromagnetic energy generated in different frequencies or between a frequency band, and the corresponding circuit will emit this energy to In the su...

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Problems solved by technology

[0003] When the electrical and electronic equipment in the optical module is working, there will be intermittent or continuous voltage and current changes, and sometimes the rate of change is quite fast, resulting in electromagnetic energy generated in different frequencies or between a frequency band, and the corresponding circuit will emit this energy to In the surrounding environment, on the one hand, there is signal radiation, which leaks out through the seams, slots, openings or other gaps in the shell; Free radiation in the space, which can cause interference and cause EMC problems

[0004] At present, two methods are mainly used to solve EMC problems. Method 1: Use shielding means to design and process structural components to be sufficiently sealed so that neither conduction radiation nor space radiation will leak, and internal devices will not be affected by external interference. , but limited by structural parts design, processing accuracy, matching of structural parts and devices, etc., it is unrealistic for structural parts to achieve an ideal sealing state in this way; Conductive foam and wave-absorbing materials are added to some parts of the parts. Conductive foam and wave-absorbing materials consume electromagnetic waves that affect the system by converting electromagnetic waves into heat energy. However, the addition of conductive foam and wave-absorbing materials in this way increases assembly Difficulty also increases the cost of the whole machine, and the improvement process requires repeated verification and sufficient assembly consistency, which has low reliability and is not conducive to mass production

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