10G-PON application oriented cooler-free OLT optical assembly and optical module

Abstract

The invention discloses a 10G-PON application oriented cooler-free OLT optical assembly and optical module. A special 1577nm direct modulation laser (DML) is used, a dispersion effect can be reduced,and 10G-PON down transmission requirement can be satisfied. The temperature of the DML needs not to controlled via a semiconductor cooler (TEC) in packaging design. A heater is used in packaging, whenthe temperature is too low, the heater starts working, the working temperature range of the laser can be narrowed effectively, and the wavelength drift of the DMS does not go beyond the range (1575-1580nm) prescribed by 10G-PON within a wider ambient temperature change range. The semiconductor cooler is not needed, the power consumption is reduced, a packaging structure is simplified, the packaging yield rate is improved, and the cost of the 10G-PON OLT optical assembly and optical module are reduced greatly.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a 10G-PON application-oriented DML optical component without a cooler, an OLT optical module and a system using the same. Background technique [0002] As a new-generation broadband solution, the optical fiber access network has been widely used to provide users with a high-bandwidth, full-service access platform. And FTTH (Fiber To The Home, fiber to the home, connecting the fiber directly to the user's home) is called the most ideal business transparent network, and it is the ultimate way for the development of the access network. [0003] Among various schemes, a point-to-multipoint (P2MP) optical fiber access mode PON (Passive Optical Network, Passive Optical Network) is the best choice. PON is an optical distribution network that is applied to the access network, and is composed of a passive optical cable, an optical splitter / combiner (Splitter), etc. between ...

AI Technical Summary

Problems solved by technology

[0014] 1. The process of EML laser itself is complicated, the cost is high, and the output optical power is low

[0015] 2. Use TEC to control the working temperature of EML laser, resulting in excessive power consumption

Especially for the highly integrated Combo-PON, power consumption has become a difficult problem to solve

[0016] 3. There are many internal components in the optical component, the structure is complex, the packaging process is long, and the laser bonding accuracy is high, and the yield rate of the packaging process is low

[0017] 4. The overall cost of optical components is high

[0018] 5. In the circuit design of the optical module, a dedicated EML driver chip and a TEC driver chip are required, which are expensive and further increase the overall power consumption

[0019] 6. The design of 10G-PON OLT requires a powerful ventilation and cooling system

Moreover, due to the power consumption and size of the optical module, the port density of the board is low (currently each motherboard generally only has 8 10G-PON ports)

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