Horizontal continuous electroplating device and preparation method thereof

An electroplating device, a horizontal technology, applied in the direction of printed circuit manufacturing, electrical components, electrolysis process, etc., can solve the problems of lotus leaves and white spots on the edge of the board, and achieve the effect of increasing electrical conductivity, uniform current distribution, and improving product quality

Pending Publication Date: 2018-10-09
捷成微系统(惠州)股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention provides a horizontal continuous electroplating device that has strong perforation ability, effectively solves the problem of lotus leaves, white spots and pinholes on the edge of the plate in the prior art, and effectively improves the quality of the plated parts.

Method used

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  • Horizontal continuous electroplating device and preparation method thereof
  • Horizontal continuous electroplating device and preparation method thereof
  • Horizontal continuous electroplating device and preparation method thereof

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the product of the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings.

[0029] like Figure 1 to Figure 3 As shown, a horizontal continuous electroplating device comprises an electroplating tank 1 filled with a copper-plating liquid, immersed in an electroplating tank 1 filled with a copper-plating liquid and an upper and lower anode electroplating spray pipe 4 that sprays the liquid to the plated parts, and uses The horizontal conveying roller device 3 for horizontally conveying the plating plate, and the cathode copper conductive roller 5 located on the horizontal conveying frame 6 and placed on the plating plate up and down, the anodic electroplating spray pipe 4 is a tubular type made of titanium structure, the anodic plating spray pipe 4 is coated with an iridium oxide coating on th...

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Abstract

The invention provides a horizontal continuous electroplating device. The device comprises an electroplating tank containing a copper plating liquor, upper anode electroplating spray pipes, lower anode electroplating spray pipes, upper conveying rollers, lower conveying rollers and cathode copper conductive rolling wheels; the upper anode electroplating spray pipes and the lower anode electroplating spray pipes are immersed in the electroplating tank containing the copper plating liquor and are used for spraying the liquor to a plating part; the upper conveying rollers and the lower conveyingrollers are used for horizontally conveying the plating plate; the cathode copper conductive rolling wheels are positioned on a horizontal conveying frame and are arranged above and below the platingplate; and each anode electroplating spray pipe is of a tubular structure made of a titanium material. The horizontal continuous electroplating device has the advantages that the perforating capability is high, moreover, the problems of plate edge lotus leaves, white spots and pinholes in the prior art are effectively solved, and the quality of a plated part product is effectively improved.

Description

technical field [0001] The invention relates to the technical field of copper plating and electroplating, in particular to a horizontal continuous electroplating device. Background technique [0002] As we all know, electronic products are developing towards thinner and lower power. It is required to develop in the direction of dense multi-layer circuit boards, corresponding to the new requirements of the existing FPC board production process, in order to meet these series of problems and solve the original equipment problems, a new type of horizontal continuous electroplating tank was invented. [0003] The existing continuous copper plating is vertical copper plating with the following defects: [0004] (1) In traditional vertical electroplating, due to the difference in the self-weight speed of the soft board, the tension between the upper and lower sides of the plated board is different, resulting in the problem of ruffles. [0005] (2) The traditional vertical continu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/28C25D5/08H05K3/18
CPCH05K3/188C25D5/08C25D17/28
Inventor 郭立铭郭立德
Owner 捷成微系统(惠州)股份有限公司
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