Manufacturing method of packaging substrate

Abstract

The invention relates to a manufacturing method of a packaging substrate. According to the embodiment of the invention, the manufacturing method comprises steps of providing an overlapping structure,wherein the first overlapping structure comprises a first metal layer, a second metal layer and a capacitance medium layer arranged between the first metal layer and the second metal layer; carrying out patterning processing on the first metal layer of the first overlapping structure so as to form a first circuit layer; providing a carrier plate, wherein the carrier plate comprises a first surfaceand a second surface, and the first surface is opposite to the second surface; laminating a first dielectric layer and the first overlapping structure subjected to the patterning processing on the first surface and the second surface of the carrier plate; and carrying out patterning processing on the first surface and the second surface so as to form a second circuit layer. According to the invention, precise layout of inner elements of the packaging substrate is achieved; and yield efficiency of the packaging substrate is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a packaging substrate. Background technique [0002] In the current semiconductor packaging technology, placing capacitive elements inside the packaging substrate is a solution to realize the miniaturization of electronic systems. This solution is usually used in electronic products such as microphones and wearable devices, which can play a role in filtering, timing, Decoupling and the role of electrical energy storage. In this way, not only the stability and reliability of the product can be improved, but also the physical size of the product can be reduced. [0003] The capacitive element generally consists of two layers of copper foil with a thickness of 35 μm or 70 μm and a dielectric material layer with a thickness of 20 μm or less between the two layers of copper foil. Because the dielectric material layer is very thin, it is difficult to...

AI Technical Summary

Problems solved by technology

Because the dielectric material layer is very thin, it is difficult to provide sufficient support during the manufacturing process. Therefore, the traditional technology usually divides the lines on the upper and lower sides of the dielectric material layer into two parts. However, this process can only produce one substrate at a time, and the output efficiency is low.

Moreover, because the thickness of the packaging substrate to be manufactured is relatively thin, the traditional technology also requires high thin plate capability of the machine.

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