Material receiving device suitable for silicon wafer production line

Abstract

The invention relates to a material receiving device suitable for a silicon wafer production line. The material receiving device is provided with a silicon wafer conveying belt, an empty tray conveying belt, a full tray conveying belt, a visual inspection and alignment mechanism and multiple material receiving trays. The material receiving trays are put in the set area and perform automatic loading and unloading through a loading and unloading mechanism. The empty tray conveying belt provides the empty material receiving trays to the loading and unloading mechanism. The full tray conveying belt receives the material receiving trays fully loaded with the silicon wafers and unloaded by the loading and unloading mechanism. The visual inspection and alignment mechanism is arranged along the material feeding direction of the silicon wafer conveying belt. The visual inspection and alignment mechanism picks up the silicon wafers conveyed by the silicon wafer conveying belt to perform inspection and alignment and then put the silicon wafers in the corresponding material receiving trays. The material receiving device is suitable for the silicon wafer production line, meets the requirementsof automatic production and can perform online automatic detection and material receiving and automatic screening and alignment so that the manual cost can be reduced, the secondary damage can be reduced and the efficiency can be enhanced, and self-inspection is performed in material receiving and thus the situation that the poor products are mixed in the qualified products can be avoided; and thestructure is simple and scientific and reasonable so that the operation rate and the operability of the silicon wafer production line can be greatly enhanced and industrial use can be met.

Description

technical field [0001] The invention relates to the technical field of printing machines, in particular to the technical field of solar photovoltaic silicon wafer printing machines. Background technique [0002] HIT solar photovoltaic silicon wafer is composed of p / i type a-Si film on the light irradiation side and i / n type a-Si film on the back side sandwiching a single crystal silicon wafer. HIT solar photovoltaic silicon wafers are mainly based on silicon substrates. On the silicon substrates, high-energy-gap silicon nano-films are deposited, and a transparent conductive film is deposited on the surface, and a back surface electric field is provided on the back. By optimizing the surface structure of silicon, the optical absorption loss of transparent conductive oxide layer and a-Si layer can be reduced. The quality and cost of solar photovoltaic silicon wafers directly determine the quality and cost of the entire solar power generation system. [0003] With decades of ...

AI Technical Summary

Problems solved by technology

The traditional method is manual collection, which has high labor costs, high labor intensity, and low efficiency; and the splint is usually used to align the silicon wafer during the receiving process, which will inevitably cause secondary damage caused by the collision of the splint, resulting in damage to the silicon wafer and at the same time causing defects. The product is mixed into the packaging of the good product, which affects the subsequent production

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