Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat conduction multifunctional composite artificial board for floor-heating floor substrate and manufacture method thereof

A wood-based panel and multi-functional technology, which is applied to other plywood/plywood appliances, manufacturing tools, wooden veneer joints, etc., can solve the problems of composite wood-based panels or floor thermal conductivity research and patented technologies, etc., to achieve Accelerate the heat transfer rate, enhance the dimensional stability, and improve the dimensional stability of heat and humidity resistance

Active Publication Date: 2018-08-17
GUANGXI UNIV
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen from the above that there are not many researches and patented technologies related to improving the thermal conductivity of composite wood-based panels or floors, especially those that can be applied to industrialization.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat conduction multifunctional composite artificial board for floor-heating floor substrate and manufacture method thereof
  • Heat conduction multifunctional composite artificial board for floor-heating floor substrate and manufacture method thereof
  • Heat conduction multifunctional composite artificial board for floor-heating floor substrate and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Step 1: Choose veneer as the surface base material and plywood as the intermediate base material, adjust the moisture content of the surface base material and the intermediate base material at 8%, and sand them with a thickness of 12mm; select the upper and lower layers of the intermediate base material with carbon-based film Structure.

[0040] Step 2: Cutting the carbon-based film and semi-cured adhesive film, the length and width of which are 5mm larger than the fiberboard base material, wherein the melamine resin film is used as the semi-cured adhesive film, and carbon fiber paper is selected as the carbon-based film.

[0041] Step 3: Carry out blank assembly, from top to bottom are surface substrate, semi-cured film, carbon-based film, semi-cured film, intermediate substrate, semi-cured film, carbon-based film, semi-cured film, surface layer Substrate.

[0042] Step 4: Place the above-assembled slabs between the upper and lower platens of the hot press for hot pre...

Embodiment 2

[0046] Step 1: Choose veneer as the surface base material and plywood as the intermediate base material, adjust the moisture content of the surface base material and the intermediate base material at 8%, and sand them with a thickness of 12mm; select the upper and lower layers of the intermediate base material with carbon-based film Structure.

[0047] Step 2: Cutting the carbon-based film and the semi-cured film, the length and width of which are 5mm larger than the fiberboard base material, wherein the melamine resin film is used as the semi-cured film, and the carbon fiber felt is used as the carbon-based film.

[0048] Step 3: Carry out blank assembly, from top to bottom are surface substrate, semi-cured film, carbon-based film, semi-cured film, intermediate substrate, semi-cured film, carbon-based film, semi-cured film, surface layer Substrate.

[0049] Step 4: Place the above-assembled slabs between the upper and lower platens of the hot press for hot pressing. The unit...

Embodiment 3

[0053] Step 1: Choose veneer as the surface base material and plywood as the intermediate base material, adjust the moisture content of the surface base material and the intermediate base material at 8%, and sand them with a thickness of 12mm; select the upper and lower layers of the intermediate base material with carbon-based film Structure.

[0054] Step 2: Cutting the carbon-based film and the semi-cured film, the length and width of which are 5mm larger than the fiberboard base material, among which the melamine resin film is used as the semi-cured film, and the carbon material impregnated felt film is used as the carbon-based film .

[0055] Step 3: Carry out blank assembly, from top to bottom are surface substrate, semi-cured film, carbon-based film, semi-cured film, intermediate substrate, semi-cured film, carbon-based film, semi-cured film, surface layer Substrate.

[0056] Step 4: Place the above-assembled slabs between the upper and lower platens of the hot press ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Gram weightaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a heat conduction multifunctional composite artificial board for a floor-heating floor substrate and a manufacture method thereof. The heat conduction multifunctional compositeartificial board comprises a surface layer substrate, a glue layer, a heating layer and an intermediate substrate. The heating layer is a carbon-based film, at least one carbon-based film is correspondingly arranged on the upper side and the lower side of the intermediate substrate, and heat-conducting layers are arranged on the side faces of the periphery of the heat conduction multifunctional composite artificial board for the floor-heating floor substrate. The heat-conducting layers are formed by coating heat-conducting paint. According to the heat conduction multifunctional composite artificial board, the heat-conducting layers can form rapid heat-conducting channels and enhance the heat-conducting performance; at the same time, after the implanted carbon-based film and bonding materials are fused and solidified, the mechanical and mechanical properties such as structural stability, bonding strength, bending strength and impact resistance can be effectively enhanced; and at the same time, because the implanted carbon-based film has good conductivity, the good antistatic and electromagnetic radiation shielding properties are achieved. The manufacture method can effectively improve the heat-conducting property and dimensional stability while improving the manufacture efficiency, and the large-scale production is facilitated.

Description

technical field [0001] The invention relates to the technical field of wood-based panels. More specifically, the present invention relates to a thermally conductive multifunctional composite wood-based panel for floor heating floor substrates with good thermal conductivity, stable structure, high strength and antistatic and harmful electromagnetic wave shielding functions and its manufacturing method. Background technique [0002] The thermally conductive multifunctional composite wood-based panel for floor heating floor base material is hot-pressed and glued with impregnated film paper, carbon-based film and base material through wood-based panel hot-pressing technology, and is mainly used to manufacture wooden floor for floor heating; the base material includes single Board or veneer, plywood, particle board, fiberboard, blockboard, integrated veneer and bamboo-wood composite board, etc. In recent years, the market demand for floor heating has been strong. The floor heati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B27D1/04B27D1/08B27D5/00B27G11/00B24B1/00B27M3/04B32B21/14B32B9/00B32B9/04B32B27/04B32B9/02B32B21/02
CPCB24B1/00B27D1/04B27D1/08B27D5/00B27G11/00B27M3/04B32B5/02B32B9/02B32B9/047B32B21/02B32B21/10B32B21/14B32B2260/021B32B2260/046Y02B30/00
Inventor 袁全平曹槊昂邵闯苏初旺岑路梅黄渊林志张彬霞
Owner GUANGXI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products