A kind of copper alloy material and its application

Abstract

Disclosed is a copper alloy material, the composition thereof comprising, in percentages by weight: 5.01-15.0 wt% of Zn, 0.1-3.0 wt% of Ni, 0.1-2.0 wt% of Sn, 0.01-0.5 wt% of Si, 0.01-0.25 wt% of P, 0-0.2 wt% of Mg, 0-0.3 wt% of Fe, and the balance of Cu and inevitable impurities. The copper alloy has a yield strength of ≥600 MPa, an electrical conductivity of ≥30% IACS, an R / t value in a GW direction of ≤1, an R / t value in a BW direction of ≤2, and a residual stress of ≥70% after having been maintained at a temperature of 150ºC for 1000 hours; and the copper alloy material can be processed into products such as bar wires and plate strips, and satisfies the requirements for copper alloy materials in a number of industries such as connectors, relays, switches, sockets and lead frames.

Description

technical field [0001] The invention relates to the technical field of copper alloys, in particular to a copper alloy material with excellent yield strength, electrical conductivity and stress relaxation resistance and good bending processability, which can be applied to connectors, relays, switches, sockets, lead frames and other industries. Background technique [0002] In recent years, with the development of the electronics industry, terminal consumer electronic equipment is developing toward miniaturization, thinning and light weight, and the components such as terminals and connectors used use smaller electrical components with narrower electrode spacing. Due to such miniaturization, the materials used have also become thinner. However, from the perspective of connection reliability, the insertion force required for connection has not been reduced, which affects material strength, electrical conductivity, and stress relaxation resistance. And bending performance puts f...

AI Technical Summary

Problems solved by technology

[0003] Traditional brass, phosphor bronze, beryllium bronze, and copper-nickel-silicon-based copper alloys have been used in the electronics industry, but with the development of the electronics industry, these materials are difficult to meet the needs of cost and performance at the same time

Among them, the comprehensive performance of brass is insufficient, and it is difficult to meet the high demand for strength ≥ 550 MPa, electrical conductivity ≥ 25% IACS, stress relaxation resistance (1000 hours at 150 ℃, residual stress ≥ 60%) and bending processing performance. field

Phosphor bronze is an alloy whose strength is improved through work hardening. When it is kept at 150°C for 1000 hours, the residual stress is ≤50%, and its stress relaxation resistance is poor. The cost of materials is reduced, and the conductivity of phosphor bronze is low, only below 20% IACS, which cannot meet the requirements of high conductivity conditions, and has certain restrictions on the application of phosphor bronze

Beryllium bronze is prone to produce highly toxic substances in the production process and is expensive, so it is generally only used in certain military fields that require high elasticity and strength

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