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Film forming assembly, bearing assembly thereof and film forming method

A film-forming method and component technology, which is applied in the field of film-forming, film-forming components and their carrying components, can solve problems such as disadvantages, poor versatility of mask plates, and reduce film-forming shadow effects, so as to improve versatility and reduce shadow effects Effect

Inactive Publication Date: 2018-08-03
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the magnetic field distribution of the existing stage is fixed. When a different type of mask is replaced, the arrangement of the through holes of the mask before and after the replacement is different, and the magnetic field distribution does not match the arrangement of the through holes after the replacement. Ensure that the distance between the mask and the substrate to be filmed is minimized, that is, its versatility to mask types is poor, and of course it is not conducive to reducing the shadow effect during film formation

Method used

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  • Film forming assembly, bearing assembly thereof and film forming method
  • Film forming assembly, bearing assembly thereof and film forming method
  • Film forming assembly, bearing assembly thereof and film forming method

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Embodiment Construction

[0025] The main purpose of this application is: the stage is provided with a plurality of magnetic parts, and each magnetic part is movably connected or detachably connected with the stage. The arrangement of the magnetic parts on the stage is used to adjust the magnetic field distribution above the stage, so that the mask plate is evenly distributed magnetic force, so that the mask plate can be as close as possible to the substrate to be filmed, minimizing the The distance from the substrate to be filmed is small, so the present application is beneficial to improve the versatility of the carrier to the mask plate type and reduce the shadow effect.

[0026] This application can be used to vapor-deposit preset patterns on various types of substrates to be film-formed, such as vapor-depositing OLEDs (Organic Light Emitting Diode, organic electroluminescent diodes) in sub-pixel regions of display panels. Moreover, the film forming methods include but are not limited to CVD (Chemi...

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Abstract

The invention discloses a film forming assembly, a bearing assembly thereof and a film forming method. The film forming assembly comprises a platform deck and a mask plate born above the platform deck, wherein the mask plate comprises a mask plate body and through holes penetrating through the mask plate body; the platform deck is provided with a plurality of magnetic pieces; and each of the magnetic pieces is movably or detachably connected with the platform deck to adjust the arrangement manner of the magnetic pieces on the platform deck according to the through holes of the mask plate. Based on this, the film forming assembly can improve the universality of the mask plate type to reduce the shadow effect during film forming.

Description

technical field [0001] The present application relates to the field of display technology, specifically to the field of vapor deposition technology, and in particular to a film forming component, a carrying component thereof, and a film forming method. Background technique [0002] In the traditional evaporation film-forming process, the mask plate is closely attached to one side of the substrate to be film-formed. There are pre-typed through holes (also known as evaporation holes) on the mask plate, and the organic material passes through the mask plate. The through holes are deposited on the predetermined area of ​​the substrate to be filmed, so as to form a film with a predetermined pattern on the substrate to be filmed. In the actual scene, there is more or less a gap between the mask plate and the substrate to be filmed. During the evaporation process, the film-forming material will infiltrate from the gap through the through hole, thus forming a large gap around the th...

Claims

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Application Information

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IPC IPC(8): C23C14/04C23C16/04
CPCC23C14/042C23C16/042
Inventor 郭天福徐湘伦
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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