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Substrate structure and fabrication method thereof

A technology of substrate structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., to achieve the effects of reducing the risk of film tearing, eliminating alignment offset, and improving bending resistance

Active Publication Date: 2018-07-27
YUNGU GUAN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, it is necessary to provide a substrate structure capable of realizing pattern diversification and its manufacturing method for the problem of how to realize pattern diversification.

Method used

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  • Substrate structure and fabrication method thereof
  • Substrate structure and fabrication method thereof
  • Substrate structure and fabrication method thereof

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Embodiment Construction

[0033] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0034] A method for fabricating a substrate structure in an embodiment includes the following steps:

[0035] S10 , providing a supporting base 110 .

[0036] See figure 1 , usually a rigid substrate is used as the support base 110, such as a glass base.

[0037] S20, forming an expose...

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Abstract

The invention relates to a substrate structure and a fabrication method thereof. The fabrication method of the substrate structure comprises the following steps of providing a support substrate; forming an exposed light-sensitive material layer on the support substrate, wherein the exposed light-sensitive material layer is provided with a first bonding force region and a second bonding force region, and the bonding force of the first bonding force region and the support substrate is smaller than the bonding force of the second bonding force region and the support substrate; and forming a flexible substrate on the exposed light-sensitive material layer, removing the light-sensitive material on the first bonding force region and the flexible substrate to obtain a patterned light-sensitive material layer and a patterned flexible substrate layer so as to obtain the substrate. In the fabrication method of the substrate structure, the first bonding force region and the second bonding force region in arbitrary patterns can be obtained by exposure; and since the bonding force of the first bonding force region and the support substrate is relatively small, the light-sensitive material on the first bonding force region and the flexible substrate are removed from the support substrate, so that versatile patterns of the substrate structure is achieved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate structure and a manufacturing method thereof. Background technique [0002] In recent years, display devices with flexible substrates have broad application prospects in mobile or handheld display devices due to their bendable properties. Plastic substrates such as polyimide substrates, polyethersulfone substrates, etc., which are excellent in heat resistance and strength, are often used as flexible substrates. [0003] The traditional manufacturing method of the substrate structure is to coat the precursor solution of the flexible substrate on the support substrate, and form the flexible substrate after curing. However, the traditional manufacturing method of the substrate structure can only obtain a single figure such as a rectangle, and cannot realize pattern diversification. Contents of the invention [0004] Based on this, it is necessary to provide a substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1218H01L27/1266
Inventor 饶潞黄金雷梁超都秉龙刘如胜
Owner YUNGU GUAN TECH CO LTD
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