Organic chemical silvering liquid medicine

An electroless silver plating, organic technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., to achieve the effects of not easy to change color, solve environmental problems, and good corrosion resistance

Inactive Publication Date: 2018-07-06
厦门银方新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electroless silver plating potions all use water as the medium and belong to aqueous solution, which cannot avoid the occurrence of displacement reactions, so all technical defects are inevitable

Method used

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  • Organic chemical silvering liquid medicine
  • Organic chemical silvering liquid medicine
  • Organic chemical silvering liquid medicine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Organic chemical silver plating solution A, its components and dosage are:

[0035]

[0036]

[0037] The application method is as follows:

[0038] Add 1 gram of copper powder into dilute sulfuric acid solution and ultrasonically stir for 3 minutes, settle and separate, wash with deionized water for 3 times, then soak in presoaking solution, settle and separate, then add 1L of silver plating solution A drop by drop while ultrasonically stirring and heating to 45°C for reaction 1 hour. After the product is separated by sedimentation, it is washed with post-wash liquid medicine, washed with water, separated and dried.

[0039] It can be observed with the eyes that the color of the copper powder has turned gray after silver plating. The state of the coating on the surface of the copper powder is further observed with an electron microscope (SEM), and analyzed by energy spectroscopy (EDS). The results show that the copper powder has been well coated. Cover the surf...

Embodiment 2

[0041] Organic chemical silver plating solution B, its components and dosage are:

[0042]

[0043]

[0044] Use the usual horizontal electroless plating production line for printed circuit boards, use silver plating potion B, and carry out silver plating according to the following process:

[0045] Degreasing, microetching, water washing, pre-dipping (the pre-dipping solution is the corresponding silver plating solution without silver salt), immersion silver, post-washing, water washing and drying.

[0046] The silver-plated PCB board is tested by section and metallographic microscope, and the sag rate is ≤1%, which shows that there is basically no "Giavani effect".

Embodiment 3

[0048] Organic chemical silver plating solution C, its components and dosage are:

[0049]

[0050]

[0051] The preparation method and application method are the same as in Example 2. The PCB board has been tested by section and metallographic microscope, and the sag rate is ≤1%, which shows that there is basically no "Giavani effect".

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PUM

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Abstract

The invention discloses organic chemical silvering liquid medicine. The organic chemical silvering liquid medicine comprises following components including 400 g/L-1,000 g/L of an organic solvent, 0 g/L-600 g/L of water, 0.01 g/L-50 g/L of silver salt, 0.1 g/L-50 g/L of a reducing agent, 1 g/L-300 g/L of a complexing agent, 0 g/L-10 g/L of alkali and 0.01 g/L-10 g/L of a surface tension adjustingagent. According to the organic chemical silvering liquid medicine, silvering does not depend on the replacement reaction mechanism, the organic chemical silvering liquid medicine can be widely applied to copper powder silvering and printed circuit board silvering, and the galvanic effect in the printed circuit board industry is avoided; the liquid medicine is low in toxicity, a plating solution can be used for a long term, replacement is not needed, and the severe environment protection problem is solved; and a clad layer is dense, corrosion resistance is good, and color changing is not likely to happen.

Description

technical field [0001] The invention relates to a chemical solution for electroless silver plating on the surface of a copper substrate. Background technique [0002] At present, the technology of electroless silver plating on the surface of copper substrates basically relies on the mechanism of displacement reaction, that is, the silver ions in the silver plating solution undergo a displacement reaction with the copper substrate, and the silver ions react to form silver atoms and deposit on the surface of the copper substrate. At the same time, part of the copper atoms in the copper substrate become copper ions, detach from the substrate and dissolve in the liquid medicine. [0003] In the process of copper powder silver plating, this displacement reaction will cause the copper nucleus under the silver plating layer to become smaller or disappear; in the process of chemical silver plating of printed circuit boards, this displacement reaction will cause local lines to be bit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 方斌赵望朱绪敏林芳芳
Owner 厦门银方新材料科技有限公司
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