Multifunctional film pasting machine for circuit board

Abstract

The invention discloses a multifunctional film pasting machine for a circuit board. A door type rack is installed at the upper end of a conveyor belt. The lower end opening of a heating box faces thebelt surface of the conveyor belt; and a sensor is installed at one side of the heating box. A cylinder is arranged in the middle of the door type rack. A roller rack is connected with an upper hot-pressing roller in a rotation manner; a film paying-off roller is arranged at the right side of the upper hot-pressing roller; and a film take-up roller is arranged at the right side of the film paying-off roller. A lower hot-pressing roller is fixed in the middle of a cross beam by a fulcrum bar. The lower hot-pressing roller and the upper hot-pressing roller are arranged at the upper side and thelower side of the belt surface of the conveyor belt symmetrically. According to the multifunctional film pasting machine having advantages of reasonable structure and high practicability, the lower hot-pressing roller and the upper hot-pressing roller enable a film to be pasted on a circuit board; and heating devices are arranged in the lower hot-pressing roller and the upper hot-pressing roller,so that the pasting effect is improved by heating during the film pasting process; with the sensor, sensing of passing of a circuit board is realized; and the cylinder can drive the upper hot-pressingroller to move downwardly. The multifunctional film pasting machine has high practicability.

Description

technical field [0001] The invention belongs to the technical field of circuit board film pasting, and in particular relates to a multifunctional circuit board film pasting machine. Background technique [0002] The dry film is composed of polyethylene protective film, photoresist film and carrier polyester film. The application of dry film can greatly simplify the manufacturing process of printed circuit boards, which is conducive to the realization of mechanization and automation. Laminating is usually done on a film applicator, where three key factors need to be aware of: pressure, temperature and conveying speed. The pressure can be adjusted before the film is attached, and it can be fixed after being fixed. The transmission speed is related to the temperature, and the influence of temperature on the effect of the film is very important. If the temperature is too high, the dry film image will become brittle and the plating resistance will be poor. If the temperature is t...

AI Technical Summary

Problems solved by technology

The pressure can be adjusted before the film is attached, and it can be fixed after being fixed. The transmission speed is related to the temperature, and the influence of temperature on the effect of the film is very important. If the temperature is too high, the dry film image will become brittle and the plating resistance will be poor. If the temperature is too low, If the dry film does not adhere firmly to the copper surface, it is easy to warp or even fall off during the development or electroplating process.

Especially in mass production, it is difficult for the hot pressing roller to provide enough heat, resulting in an unsatisfactory film sticking effect

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