A three-axis vibration excitation device for dynamic loading of mems microstructure

Abstract

The invention discloses a three-axis vibration excitation device for dynamically loading MEMS microstructures, including sleeves, piezoelectric ceramics, pressure sensors, upper and lower coupling blocks, steel balls, elastic supports and MEMS microstructures ;Annular top plate and bottom plate are arranged at both ends of the sleeve, and the microstructure is set on the top plate through elastic supports; guide shafts are evenly distributed between the top plate and the bottom plate, and the lower connecting block is provided with a guide arm and is penetrated by the sleeve wall. Fitted on the guide shaft, locking devices are respectively provided on the guide arms; spherical grooves are respectively provided on the upper connecting block and the lower connecting block; piezoelectric ceramics are sandwiched between the pressure sensor and the elastic support; The outer edge of the upper coupling block is supported in the sleeve by the ball plunger connected with the connecting rod. The device can apply different sizes of pre-tightening force to the piezoelectric ceramics, so that the obtained pre-tightening force measurement value is more accurate, and the adjustment process of compensating the parallelism error of the two working surfaces of the piezoelectric ceramics becomes smoother and smoother, which is convenient Test dynamic characteristic parameters.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a three-axis vibration excitation device for dynamically loading MEMS microstructures. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is first n...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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