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Polyurethane modified epoxy resin composition used for packaging semiconductor

A polyurethane modification and epoxy resin technology, applied in the field of polyurethane modified epoxy resin composition, can solve the problems of lower modulus, lower stress, high modulus, etc., to reduce modulus, improve processability and solder resistance , the effect of improving reliability

Inactive Publication Date: 2018-06-15
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the application of the semiconductor industry, the epoxy resin composition used for packaging, due to the structure of the epoxy resin itself, has strong rigidity and high modulus after high temperature curing; in terms of semiconductor packaging, especially the chip type packaging, it needs to undergo close 240-265°C reflow soldering to the circuit board, high rigidity or modulus may easily cause too much stress between the epoxy resin composition and the chip or frame during the high temperature reflow soldering process, which will affect the reliability of the entire semiconductor device
[0003] The traditional improvement method is to add a stress-reducing elastomer to reduce the modulus, but there are many problems to be solved when adding such a low-stress elastomer, such as the decrease in the bulk strength of the resin composition, and poor compatibility between the elastomer and the epoxy resin system , process problems are prone to occur during the packaging process, etc.
It is often to compensate by sacrificing other properties while reducing stress, and it is impossible to meet the same requirements of reducing stress and basically not affecting other properties; thus relatively restricting the development of epoxy resin compositions for semiconductor packaging, and even the entire semiconductor industry. development of

Method used

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  • Polyurethane modified epoxy resin composition used for packaging semiconductor
  • Polyurethane modified epoxy resin composition used for packaging semiconductor
  • Polyurethane modified epoxy resin composition used for packaging semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Polyurethane modified epoxy resin A1 (TPU of Changzhou Branch of Beijing University of Chemical Technology) 9wt%

[0032] Anhydride B1 (Taiwan Nanya "tetrahydrophthalic anhydride") 6wt%

[0033] Silica powder D1 (d50 is 20μm) 82wt%

[0034] Flame retardant brominated epoxy resin and antimony trioxide (the weight ratio of brominated epoxy resin and antimony trioxide is 10:1) 1.5wt%

[0035] Curing accelerator TPP C1 0.05wt%

[0036] Carnauba Wax 0.5wt%

[0037] Inorganic ion scavenger 0.45wt% (Japan TOAGOSEI Co., Ltd system IXE500 (Bi 2 o 3 ·3H 2 O))

[0038] γ-glycidyl propyl ether trimethoxysilane 0.5wt%

[0039] Carbon black 0.5wt%

[0040] After weighing and mixing uniformly according to the above proportions, the obtained mixture is melted and kneaded on a double-roller kneader preheated at a temperature of 70-100°C, and the melted and kneaded uniform material is mixed from the double-roller Take it off the machine, cool it down naturally, and pulverize it ...

Embodiment 2～8

[0050] The composition of the polyurethane modified epoxy resin composition used for semiconductor encapsulation is shown in Table 1, and the preparation method is the same as

[0051] Example 1, the evaluation method is the same as in Example 1, and the evaluation results are shown in Table 1.

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Abstract

The invention relates to an epoxy resin composition, and is especially relates to a polyurethane modified epoxy resin composition used for packaging a semiconductor. Through the modification of epoxyresin by polyurethane, the modified epoxy resin and phenolic resin are matched, and the polyurethane modified epoxy resin composition used for packaging the semiconductor is obtained, modulus of the epoxy resin composition is greatly reduced, manufacturability and soldering resistance of the epoxy resin composition used for packaging the semiconductor are increased, and the reliability of the epoxy resin composition is increased for semiconductor packaging. The polyurethane modified epoxy resin composition has necessary fluidity, filling performance and flame resistance.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a polyurethane-modified epoxy resin composition suitable for semiconductor packaging with low modulus performance, good molding process performance and reliability. Background technique [0002] In the application of the semiconductor industry, the epoxy resin composition used for packaging, due to the structure of the epoxy resin itself, has strong rigidity and high modulus after high temperature curing; in terms of semiconductor packaging, especially the chip type packaging, it needs to undergo close Reflow soldering at 240-265°C is soldered to the circuit board. High rigidity or modulus will easily cause too much stress between the epoxy resin composition and the chip or frame during the high temperature reflow soldering process, which will affect the reliability of the entire semiconductor device. [0003] The traditional improvement method is to add a stress-reducing elastomer t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/04C08L91/06C08L63/00C08K13/06C08K9/06C08K3/36C08K3/22C08K3/04
CPCC08L75/04C08L63/00C08L2201/02C08L2203/206C08L2205/025C08L2205/03C08L2205/035C08L91/06C08K13/06C08K9/06C08K3/36C08K3/2279C08K3/04
Inventor 李海亮李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司
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