LTCC ultrafast machining system and method thereof

Abstract

The invention relates to a LTCC ultrafast machining system and a method thereof. The system is provided with a laser, a first reflecting unit, a light beam shaping module, an attenuation module, a second reflecting unit, a first scanning unit, a third reflecting unit and a second scanning unit in a light path direction; the laser outputs light beams; the first reflecting unit emits the light beams, output from the laser, into the light beam shaping module; the light beam shaping module expands and filters the light beams; the attenuation module divides incident light into two light beams in aparallel direction and a perpendicular direction; the second reflecting unit emits P polarized light, divided in the horizontal direction, to the first scanning unit; the first scanning unit focuses the light beams reflected by the second reflecting unit, and a field lens is focused on machined objects; the third reflecting unit emits S polarized light, divided in the vertical direction, to the second scanning unit; and the second scanning unit focuses the light beams reflected by the third reflecting unit, and a field lens is focused on the machined objects. A ultrafast green-light picosecondlaser and a matched high-speed galvanometer and optical device are adopted; the diameters of micro through holes on a LTCC substrate are reduced below 50 microns; the roundness of the micro through holes reaches above 95%; and the taper is within 3 microns.

Description

technical field [0001] The invention relates to an LTCC ultrafast processing system and a method thereof. Background technique [0002] At present, the manufacture of high-density low-temperature cofired ceramics (LTCC) substrates relies on the fine interconnection technology of the internal conductors of the substrate. In recent years, with the development of microelectronics technology and packaging technology, the density of VLSI is getting higher and higher. In order to meet the technological requirements of high-density interconnection of LTCC multilayer substrates, the diameter of the micro-vias and the width of the wires must be reduced to less than 100 μm or even 50 μm. At the same time, the number of micro-vias on each LTCC substrate reaches 50K or even more than 100K, and the spacing accuracy of micro-vias is getting higher and higher. [0003] For arbitrary shape cutting and microhole (<100μm) processing, traditional processing methods are difficult to meet t...

AI Technical Summary

Problems solved by technology

[0004] At present, the LTCC substrate micro-via laser drilling machine on the market is mainly aimed at micro-holes with a diameter of 50-100 μm, which is limited by the type of laser and the selection of other optical devices, and it is difficult to achieve micro-vias with a diameter of less than 50 μm. requirements, and the processing efficiency is difficult to exceed 1000 holes / second. Even if the efficiency is barely improved to meet the requirements, the ensuing precision of the micro-via spacing also makes the laser drilling machines on the market prohibitive.

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