Ultrafast laser film hole efficient processing method and device

An ultra-fast laser and processing method technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of reducing the efficiency of hole making, and the accumulation of residual plasma cannot be discharged, so as to achieve good processing effect and prevent focusing mirror Pollution, good effect of slag discharge efficiency

Pending Publication Date: 2018-05-15
XIAN MICROMACH TECH CO LTD
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Problems solved by technology

[0004] The purpose of the present invention is to provide an ultra-fast laser gas film hole efficient processing method and device, to solve the problem that residues and plasma accumulation cannot be discharged during the processing of micro-holes with high depth-to-diameter ratio, and the problem of reducing the hole-making efficiency

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  • Ultrafast laser film hole efficient processing method and device
  • Ultrafast laser film hole efficient processing method and device
  • Ultrafast laser film hole efficient processing method and device

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0028] The invention adopts an ultra-fast laser and a part flip structure to complete the slag discharge effect in the hole making process, and at the same time realizes a process method and a device for efficiently processing the microholes of the part under the action of an auxiliary air flow.

[0029] from figure 1 It can be seen that the device mainly includes a beam scanning drilling system and a slag discharge system. The beam scanning drilling system mainly includes a laser 15 , a beam modulation module 14 , a three-dimensional scanning device 13 , a focusing mirror 12 and a workbench 30 arranged in sequence. The pre-processed part 6 is fixed upside down on the table 30 . The laser beam is emitted from the laser 15, and after being modulated and shaped by the beam modulation module 14, it is deflected and translated by the three-dimens...

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Abstract

The invention belongs to the technical field of laser processing, and particularly relates to an ultrafast laser film hole efficient processing method and device. Laser beams emitted by a laser deviceare transmitted vertically upwards after going through a scanning device and being focused, a preprocessing part is fixed on a workbench vertically downwards, the laser beams are enabled to align ata to-be-processed part, and laser scans to generate micropores; the method further includes: generating a negative pressure domain around micropore orifices, and generating a positive pressure domainalong the middle way of a laser path. The problem that hole making efficiency is lowered due to the fact that residue and plasma gather and cannot be discharged during processing of high-depth-diameter-ratio micropores.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a method and a device for realizing high-efficiency processing of microholes with a high depth-to-diameter ratio by using an ultrafast laser. Background technique [0002] Ultrafast laser (picosecond, femtosecond) hole making technology is the latest technological means for blade air film hole, flame tube air film hole, aviation fuel injector micro hole and automobile fuel injector micro hole processing, but these fields need The diameter of many micro-holes is between 0.3-0.5mm, but the maximum depth needs to be processed to 8-10mm, and the depth-to-diameter ratio exceeds 20:1. However, the stable depth-to-diameter ratio that can be achieved in the current laser drilling technology is 10: 1, and the processing efficiency is low. Therefore, the efficient processing of micro-holes with a high depth-to-diameter ratio is a technical problem that has been diffic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/142B23K26/70
CPCB23K26/142B23K26/1435B23K26/382B23K26/702
Inventor 贺斌赵卫焦悦田东坡
Owner XIAN MICROMACH TECH CO LTD
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