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Imaging element and imaging apparatus

A technology for imaging components and components, applied in electrical components, radiation control devices, electrical solid-state devices, etc., can solve the problems of low extinction ratio and low transmittance of wire grid polarizing components, achieve high reliability and improve transmittance and extinction ratio, the effect of improving the manufacturing yield

Active Publication Date: 2018-05-11
SONY SEMICON SOLUTIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, n 0 Larger values ​​of lead to lower transmission and lower extinction ratio of the wire grid polarizing element

Method used

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  • Imaging element and imaging apparatus
  • Imaging element and imaging apparatus
  • Imaging element and imaging apparatus

Examples

Experimental program
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Effect test

Embodiment 1

[0091] 2. Example 1 (the imaging element and the imaging device according to the first embodiment of the present disclosure and the imaging element and the imaging device according to the second embodiment of the present disclosure, the imaging element-A, the imaging element according to the first-A embodiment, etc. , the imaging element etc. according to the first-D embodiment, the imaging element etc. according to the second-A embodiment, the imaging element etc. according to the second-D embodiment)

Embodiment 2

[0092] 3. Embodiment 2 (Modification of Embodiment 1 and Imaging Element-B of the Present Disclosure)

[0093] 4. Example 3 (Modifications of Examples 1 and 2, Imaging Element etc. According to First-B Embodiment, Imaging Element etc. According to Second-B Embodiment)

[0094] 5. Example 4 (Modifications of Examples 1 to 3, Imaging Element etc. According to First-C Embodiment, Imaging Element etc. According to Second-C Embodiment)

[0095] 6. Other

[0096]

[0097] In the imaging element according to the first embodiment of the present disclosure or in the imaging device according to the first embodiment of the present disclosure (hereinafter, these imaging elements are collectively referred to as "the imaging element etc. according to the first embodiment of the present disclosure") In, the second protective layer is formed between the wire grid polarizing element and the protective layer. When the refractive index of the material used for the protective layer is specifi...

Embodiment 3

[0176] Example 3 is a modified example of Example 1 and Example 2, and relates to the imaging element and the like according to the first-B embodiment and the imaging element and the like according to the second-B embodiment. in such as Figure 11 or Figure 12 In the imaging element of Example 3 shown in the schematic partial sectional view of , a drive circuit 32 is formed on one surface of a substrate 31 to drive a photoelectric conversion unit 40 , and a photoelectric conversion unit 40 is formed on the other surface of the substrate 31 , and a buried image is formed at the edge portion of the imaging element 21 in a manner extending from one surface of the substrate 31 to the other surface and further extending to the underside of the wire grid polarizing element 50 (also directly below the wire grid polarizing element 50). Groove portion 34 filled with insulating material or light-shielding material. The insulating material can be, for example, SiO 2 , and the light-s...

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Abstract

There is provided an imaging element including a photoelectric conversion unit formed in a substrate and a wire grid polarizer disposed at a light-incident side of the photoelectric conversion unit. In addition, the wire grid polarizer includes a plurality of strip-shaped portions, where air gaps exist between adjacent strip-shaped portions. Further, a protective layer is formed on the wire grid polarizer.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of a prior Japanese patent application JP2015-202660 filed on October 14, 2015, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to an imaging element and an imaging device including the imaging element. Background technique [0004] For example, as described in JP 2012-142501A, an imaging device including a plurality of imaging elements having a wire grid polarizing element (WGP) is known. A photoelectric conversion region included in a photoelectric conversion unit of an imaging element to generate a current based on incident light is formed, for example, of a charge coupled device (CCD) and a complementary metal oxide semiconductor (CMOS) image sensor. The wire grid polarizing element is disposed on the light incident side of the photoelectric conversion unit and has a line-and-space structure. For conveni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14605H01L27/14621H01L27/14625H01L27/14629H01L27/14627H01L27/14636H01L27/14623H01L27/1464H01L27/14685
Inventor 丸山康
Owner SONY SEMICON SOLUTIONS CORP
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