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Low-warpage acrylate adhesive capable of being quickly cured at low temperature and preparation method thereof

An acrylate, rapid curing technology, applied in the direction of adhesives, adhesive additives, non-polymer organic compound adhesives, etc., can solve the problems of high warpage rate and large deformation of the adherend, and achieve low warpage rate and high viscosity The effect of improving bonding strength and improving production efficiency

Active Publication Date: 2018-05-08
CHANGCHUN YONGGU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of large deformation and high warpage rate of the adherend after curing in the existing epoxy resin adhesive, the present invention provides an acrylate adhesive that can be cured quickly at low temperature and has low warpage and its Preparation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] An acrylic adhesive that can be quickly cured at low temperature and has low warpage, its components and the weight percentage of each component are as follows:

[0060] Mixture of aliphatic polyurethane diacrylate and tripropylene glycol diacrylate 28%;

[0061] Blend of isobornyl methacrylate and trimethylolpropane trimethacrylate 19%;

[0062] A blend of tert-butyl peroxybenzoate and dibenzoyl peroxide 4%;

[0063] Fumed silica 5%;

[0064] Mixture of methylbenzoquinone, hydroquinone and 2,5-dichloro-1,4-benzoquinone 0.1%;

[0065] Anilinomethyltriethoxysilane 1%;

[0066] Chrome green 0.9%;

[0067] Blend of Quartz, Mica and Talc 37%;

[0068] Epoxy-terminated reactive liquid nitrile rubber 5%.

[0069] Preparation process: According to the proportion, first mix the diluent, polymerization inhibitor and curing agent evenly, then add acrylate resin, adhesion promoter, dye and rubber to it and continue mixing for about 30 minutes until the components are evenly ...

Embodiment 2

[0072] An acrylic adhesive that can be quickly cured at low temperature and has low warpage, its components and the weight percentage of each component are as follows:

[0073] 9 (ethoxy) trimethylolpropane triacrylate 40%;

[0074] Dipropylene glycol diacrylate 14%;

[0075] Tert-butyl peroxyneodecanoate 5.2%;

[0076] Fumed silica 8%;

[0077] A mixture of 2,5-dichloro-1,4-benzoquinone, p-hydroxyanisole, p-benzoquinone and hydroquinone 0.15%;

[0078] Mixture of γ-aminotriethoxysilane and N-β(aminoethyl)-γ-aminopropylmethyldimethoxysilane 2%;

[0079] Titanium dioxide 0.15%;

[0080] Mixture of PTFE powder and silicon dioxide 25%;

[0081] Polymer of 2,5-furandione and 1,3-butadiene 5.5%.

[0082] Preparation process: According to the proportion, first mix the diluent, polymerization inhibitor and curing agent evenly, then add acrylate resin, adhesion promoter, dye and rubber to it and continue mixing for about 30 minutes until the components are evenly dispersed, and ...

Embodiment 3

[0085] An acrylic adhesive that can be quickly cured at low temperature and has low warpage, its components and the weight percentage of each component are as follows:

[0086] 20% blend of 1,9-nonanediol diacrylate and propoxylated glycerol triacrylate;

[0087] Isobornyl methacrylate 15%;

[0088] tert-butyl peroxybenzoate, tert-butyl peroxyisooctanoate, tert-amyl peroxy(2-ethylhexanoate), dibenzoyl peroxide, and bis(4-tert-butylcyclohexyl)peroxydicarbonate 3% of the mix;

[0089] Organic bentonite 4%;

[0090] Methylbenzoquinone 0.05%;

[0091] Aminoethylaminopropyltrimethoxysilane 0.95%;

[0092] Carbon black 1%;

[0093] Mixture of Mica, Silica and Calcium Carbonate 48%;

[0094] Polymer of 2,5-furandione and 1,3-butadiene 8%.

[0095] Preparation process: According to the proportion, first mix the diluent, polymerization inhibitor and curing agent evenly, then add acrylate resin, adhesion promoter, dye and rubber to it and continue mixing for about 30 minutes unti...

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Abstract

The invention provides a low-warpage acrylate adhesive capable of being quickly cured at low temperature and a preparation method thereof, and belongs to the field of adhesive. The problems that afteran existing epoxy resin adhesive is cured, deformation of an adhered object is large and the warpage rate is very high are solved. The low-warpage acrylate adhesive is prepared from, by weight, 20-50% of acrylate resin, 5-20% of diluent, 0.1-7% of curing agent, 1-10% of thixotropic agent, 0.01-1% of polymerization inhibitor, 1-5% of adhesion promoter, 0.5-2% of dye, 20-50% of filler and 1-10% ofrubber. The prepared adhesive can achieve low-temperature fast curing at 110 DEG C for 90s and low-temperature fast curing at 90 DEG C for 10 min, the acrylate adhesive has high bonding strength and low warpage rate, and the acrylate adhesive is suitable for bonding of a temperature-sensitive plastic electronic device and a flexible circuit substrate.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an acrylate adhesive capable of rapid curing at low temperature and low warpage and a preparation method thereof. Background technique [0002] Epoxy resin adhesive has good physical and chemical properties, excellent bonding strength to various material surfaces, good dimensional stability, low curing shrinkage, high hardness and excellent weather resistance, making epoxy resin adhesive Agents are widely used in machinery, electronics, automobiles and other industrial fields. Commonly used epoxy resin adhesives are two-component and one-component. Because the two-component adhesive needs to be mixed in proportion before use, it brings inconvenience to the production operation, and the performance after curing is affected by mixing. The degree of influence is greater, and most of the current commercialized one-component epoxy adhesives have a relatively high curing...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06C09J11/08
CPCC09J4/06C09J11/04C09J11/06C09J11/08
Inventor 徐丽爽王群郑岩张强刘姝李宇郑岚
Owner CHANGCHUN YONGGU TECH
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