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Terminal support and terminal

A terminal bracket and terminal technology, which is applied in the direction of modification, cooling/ventilation/heating transformation through conduction and heat transfer, etc., can solve the problems of low thermal conductivity efficiency of the terminal bracket and poor terminal temperature rise effect, so as to avoid the local temperature overheating. High, improve the overall temperature rise effect, improve the effect of thermal conductivity

Inactive Publication Date: 2018-04-20
GUANGDONG MAXON COMM +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a terminal bracket and a terminal, aiming to solve the technical problem that the thermal conductivity of the terminal bracket is low and the overall temperature rise effect of the terminal is not good.

Method used

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Embodiment Construction

[0022] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] The technical solutions of the various embodiments of the present invention can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist , nor within the scope of protection required by the present invention.

[0024] The present invention provides a terminal bracket, referring to Figure 1 to Figure 4 , the terminal bracket includes a die-casting frame 1 and a heat-conducting layer 2 embedded in the die-casting frame 1, one or more heat dissipation areas 3 are arranged on the surface of the die-casting frame 1, and the heat dissipation area 3 is provided with a connection between the heat-conducting l...

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PUM

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Abstract

The invention discloses a terminal support and a terminal. The terminal support comprises a casting frame and a heat conduction layer, wherein the heat conduction layer is embedded into the casting frame, one or more cooling regions are arranged on a surface of the casting frame, and heat conduction grooves are formed in the cooling regions and communicate with the heat conduction layer and the exterior space of the casting frame. Heat is rapidly transferred to a region except the cooling regions of the casting frame by the heat conduction layer, large-area cooling is achieved, the heat conduction efficiency of the terminal support is indirectly improved, excessively high local temperature of the terminal support is prevented, the whole temperature rising effect of the terminal support isimproved, and the whole temperature rising effect of the terminal is further improved.

Description

technical field [0001] The invention relates to the technical field of terminal internal frame design, in particular to a terminal bracket and a terminal. Background technique [0002] As terminal products (especially mobile terminals such as smartphones) focus on thinner and lighter designs, the technical requirements for heat dissipation products are also increasing. Among them, the terminal bracket plays a pivotal role in the heat conduction of components such as its CPU and camera, and requires high thermal conductivity and good temperature uniformity. However, the brackets currently used in the industry are basically magnesium alloy die-casting frames / aluminum alloy die-casting frames / stainless steel stamping brackets / GM55 aluminum plate stamping brackets, but the thermal conductivity efficiency of these brackets is relatively low, and the temperature rise of the terminal machine Ineffective. Contents of the invention [0003] The main purpose of the present inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 石永博
Owner GUANGDONG MAXON COMM
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