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Method and device for covering FPC with film

A cover film and protective film technology, which is applied in the secondary processing of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of low production efficiency and low bonding yield of artificial film, and achieve high yield and filling speed Fast, even coverage

Active Publication Date: 2018-04-20
XIAMEN BOLION CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] For this reason, the present invention provides a kind of FPC covering film method and device, in order to solve the problem of low lamination yield rate caused by direct full-surface hot pressing in the prior art; To solve the problem of low production efficiency of artificial film sticking, and at the same time meet the continuity of Roll to Roll (roll to roll) process

Method used

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  • Method and device for covering FPC with film
  • Method and device for covering FPC with film
  • Method and device for covering FPC with film

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Embodiment Construction

[0035] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.

[0036] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0037] refer to figure 1 As shown, a kind of FPC covering film method provided by the invention comprises the following steps:

[0038] A1. Positioning film: Position the protective film on the upper and lower surface...

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Abstract

The invention provides a method for covering an FPC with a film and a device for realizing the method. The method comprises steps of adopting a film positioning step to position an FPC and a protective film, performing click prepressing and dot matrix pre-hot pressing to achieve dot matrix pre-fixing and minimize the gap between the protective film and the FPC, and finally performing the entire surface hot pressing. The dot matrix fixed point has a guiding role, and the hot-melt glue can be quickly and evenly applied after the entire surface hot pressing and is not easy to generate bubbles, sothat the protective film covers uniformly and the yield rate is high. A full-automatic film applicator for realizing the above method not only achieves the above high-yield operation, but also realizes full-automatic production, so that the production efficiency is remarkably improved, and at the same time the continuity of the Roll TO Roll process is satisfied, and the FPC is not required to becut before film covering operation.

Description

technical field [0001] The invention relates to the field of FPC technology, in particular to an FPC covering film method and device. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board), also known as soft board, is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the base material. , an indispensable and important connector for automotive consumption and electronic products. In order to ensure that the FPC can still be used normally in the harsh environment of high temperature, humidity, pollutants and corrosive gases, it is necessary to attach a cover film to the surface of the FPC to meet the requirements. [0003] Most of the existing FPC Roll to Roll (roll to roll) process is done after the graphic circuit is completed, which is used as a watershed between Roll to Roll (roll to roll) and PNL to PNL (chip to chip) process. Cut into sheets below 250*350mm, then film, laminate, and finally do oth...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/281H05K2203/0278
Inventor 周夕军
Owner XIAMEN BOLION CIRCUIT
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