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Treatment method of chemical copper plating wastewater

A technology of chemical copper plating and treatment method, which is applied in the fields of metallurgical wastewater treatment, chemical instruments and methods, water/sewage treatment, etc. Emissions, the effect of improving purification efficiency

Active Publication Date: 2018-04-20
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] To sum up, the main pollutants in the chemical copper liquid are copper ions and EDTA ions. The process of separate treatment of copper ions and EDTA ions increases the cost of wastewater treatment, complicates the process, and reduces the efficiency. , Increased risk of secondary pollution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Add 5g ethylene-vinyl acetate copolymer, 4g rosin and 3g ferrocene boric acid to the crucible, grind evenly, heat to 160°C, stir for 1 hour, cool to 150°C to get ferrocene borate glue; the area is 100cm 2 , the weight is 160g / m 2 The cellulose acetate is arranged on the turntable of the glue homogenizer, the temperature of the turntable is controlled at 150°C, and the rotation speed is 500 rpm, and 5g of ferrocene borate glue is added dropwise on the acetate cloth, and the temperature of the turntable is lowered to 25°C. Add dropwise 5 g of 3-aminopropyltrimethoxysilane in acetone solution with a mass concentration of 3%, dry it in the air, then raise the temperature of the turntable to 100°C, keep it for 10 minutes, lower the temperature of the turntable to 25°C, and stop the turntable to obtain Acetate cloth water treatment composite.

[0025] Add 100mL of deionized water, 2g of copper sulfate, 3g of citric acid, 3g of ethylenediaminetetraacetic acid, 1g of NaOH and ...

Embodiment 2

[0028] Add 10g ethylene-vinyl acetate copolymer, 8g rosin and 5g ferrocene boric acid to the crucible, grind evenly, heat to 200°C, stir for 1 hour, cool to 150°C to get ferrocene borate glue; the area is 100cm 2 , the weight is 160g / m 2 The cellulose acetate is arranged on the turntable of the glue homogenizer, the temperature of the turntable is controlled at 150°C, and the rotation speed is 500 rpm, and 5g of ferrocene borate glue is added dropwise on the acetate cloth, and the temperature of the turntable is lowered to 25°C. Add dropwise 5 g of 3-aminopropyltrimethoxysilane in acetone solution with a mass concentration of 3%, dry it in the air, then increase the temperature of the turntable to 120°C, keep it for 10 minutes, lower the temperature of the turntable to 25°C, and stop the turntable to obtain Acetate cloth water treatment composite material; wherein the solute of the 3-aminopropyltrimethoxysilane solution is 3-aminopropyltrimethoxysilane, and the solvent is acet...

Embodiment 3

[0032] Add 5g ethylene-vinyl acetate copolymer and 4g rosin to the crucible, grind evenly, heat to 160°C, stir for 1 hour, cool to 150°C to get rosin glue; 2 , the weight is 160g / m 2 The cellulose acetate is arranged on the turntable of the homogenizer, the temperature of the turntable is controlled at 150°C, and the rotation speed is 500 rpm, and 5g of rosin glue is added dropwise on the acetate cloth. A solution of 3-aminopropyltrimethoxysilane in acetone with a mass concentration of 3%, dried in the air, then raising the temperature of the turntable to 100°C, maintaining it for 10 minutes, lowering the temperature of the turntable to 25°C, and stopping the turntable to obtain acetate fiber cloth Water treatment composites.

[0033] Add 100mL of deionized water, 2g of copper sulfate, 3g of citric acid, 3g of ethylenediaminetetraacetic acid, 1g of NaOH and 0.5g of formaldehyde in a 200ml beaker, and mix well to obtain the electroless copper plating wastewater solution; Add ...

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Abstract

The invention belongs to the technical field of water treatment and relates to a treatment method of chemical copper plating wastewater. According to the method provided by the invention, the purification effect of a cellulose acetate cloth water treatment composite material on copper ions and ethylenediamine tetraacetate radical ions in the chemical copper plating wastewater is regulated throughthe components, the content and the preparation process, so that the residual concentration of the copper ions and the residual concentration of the ethylenediamine tetraacetate radical ions in the purified wastewater are less than 0.01ppm and 0.1ppm respectively, and the purpose of simultaneously purifying the copper ions and the ethylenediamine tetraacetate ions by a one-step process can be realized. Therefore the purification efficiency of the wastewater can be improved, the wastewater treatment cost is reduced, and safe discharge of the wastewater is realized.

Description

technical field [0001] The invention belongs to the technical field of water treatment, and in particular relates to a treatment method for electroless copper plating wastewater. Background technique [0002] Most of the basic components of the electroless copper plating solution are copper salts, complexing agents, stabilizers, reducing agents and additives. To prevent the generation of Cu(OH) 2 or Cu 2 O precipitation requires reducing the concentration of free copper ions in the solution, usually by adding a complexing agent to the plating solution. The concentration and stability constant of the complexing agent must be appropriate, too high concentration and stability constant will cause the plating solution to be too stable and the copper plating rate to be too small. Commonly used complexing agents include tartaric acid, ethylenediaminetetraacetic acid (EDTA), citric acid, and triethanolamine. EDTA is a complexing agent widely used in electroless copper plating so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F1/28B01J20/26B01J20/28B01J20/30C02F103/16C02F101/20C02F101/38C02F101/34
CPCB01J20/265B01J20/28033C02F1/288C02F2101/20C02F2101/34C02F2101/38C02F2103/16
Inventor 吕银祥
Owner FUDAN UNIV
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