Three-dimensional POP packaging structure and packaging method thereof

Abstract

The invention discloses a three-dimensional POP packaging structure and a packaging method thereof, which belong to the technical field of semiconductor packaging. The three-dimensional POP packagingstructure comprises at least two layers of vertically-stacked packaging bodies and a high-density flexible conversion plate carrying a rewiring metal layer, wherein the back surface of the lower packaging body is thinned to expose BGA welding balls and metal bumps to play roles of interconnection and conduction; the high-density flexible conversion plate is prepared by adopting a Liftoff process,and the needs of high-density packaging can be met. The upper packaging body and the lower packaging body are connected through packaging body III BGA support welding balls, the structure separates and independently prepares the rewiring metal layer in the traditional POP structure, and on one hand, the warping problem in the traditional process can be solved, and the high-density flexible conversion plate can meet the needs of high I / O ratio packaging.

Description

technical field [0001] The invention relates to a three-dimensional POP packaging structure and a packaging method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of electronic technology, semiconductor packaging tends to develop in the direction of high density, multi-function, low power consumption, and miniaturization. Under this circumstance, the system-in-package (SIP) of three-dimensional integration technology has developed rapidly in recent years. Among them, as one of the important ways of packaging high-density integration today, the stacked structure (POP) has obvious advantages, mainly reflected in high integration, small package size, and fast signal transmission rate. [0003] As the package size becomes smaller and smaller, the circuit distribution in the package becomes more and more complex, and the spacing between the lines and solder balls in the package in the POP package structure b...

AI Technical Summary

Problems solved by technology

[0003] As the package size becomes smaller and smaller, the circuit distribution in the package becomes more and more complex, and the spacing between the lines and solder balls in the package in the POP package structure becomes smaller and smaller. Due to the difference in thermal matching between different materials , different degrees of warpage will occur during the process, which will affect the stability of the packaging process and is not conducive to automated production

And as the package becomes thinner and thinner, the warpage will become more and more obvious. The warpage problem may lead to a series of problems such as failure of the POP package structure or performance degradation and reliability.

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