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Medium-temperature cured prepreg resin matrix for rapid molding and preparation method of medium-temperature cured prepreg resin matrix

A resin matrix, prepreg technology, applied in the field of prepreg manufacturing, can solve the problem of slow low temperature curing reaction, achieve stable heat release, shorten the medium and low temperature curing time, and smooth the surface of the sample

Inactive Publication Date: 2018-04-03
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] One of the technical problems to be solved by the present invention is the technical problem that the low-temperature curing reaction speed is relatively slow in the existing medium-temperature fast-curing prepreg resin matrix. Modified imidazole is used as the main curing agent and dicyandiamide is used as the auxiliary curing agent. A kind of medium temperature curing prepreg resin matrix for rapid prototyping and preparation method thereof

Method used

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  • Medium-temperature cured prepreg resin matrix for rapid molding and preparation method of medium-temperature cured prepreg resin matrix

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The composition of the resin matrix formula is by mass fraction:

[0046] Trifunctional glycidylamine epoxy resin MY0510: 20 parts;

[0047] Liquid bisphenol A epoxy resin 331:20 parts;

[0048] Solid bisphenol A epoxy resin 671:60 parts;

[0049] Modified imidazole LH-210: 8 parts;

[0050] Dicyandiamide 100S: 2 parts.

[0051] The preparation method of the resin matrix: break the solid epoxy resin into particles with a diameter less than 5mm, and then add each component into the container of the self-rotating and revolving vacuum mixer according to the above formula. First, stir for 3 minutes at a vacuum of 30 kPa and a rotating speed of 2000 rpm, then stir for 8 minutes at a vacuum of 0.3 kPa and a rotating speed of 2000 rpm. After the stirring is completed, an epoxy resin composition is obtained.

[0052] The preparation method of the standard spline: put the standard spline mold into the blast oven, keep it warm for 1 hour after the temperature rises to the cur...

Embodiment 2

[0055] The composition of the resin matrix formula is by mass fraction:

[0056] Liquid bisphenol A epoxy resin 331:40 parts;

[0057] Novolac epoxy resin 438: 20 parts;

[0058] Solid bisphenol A epoxy resin 671:40 parts;

[0059] Modified imidazole LH-210: 8 parts;

[0060] Dicyandiamide 100S: 1.5 parts.

[0061] The preparation method of the resin matrix and the standard spline is the same as in Example 1.

[0062] Table 1 shows the test results of the epoxy resin composition and its cured product.

Embodiment 3

[0064] The composition of the resin matrix formula is by mass fraction:

[0065] Four-functional glycidylamine epoxy resin XB9721: 20 parts;

[0066] Liquid bisphenol F epoxy resin 354:20

[0067] Solid bisphenol A epoxy resin 671:60 parts;

[0068] Modified imidazole LH-210: 8 parts;

[0069] Dicyandiamide 100S: 1.5 parts.

[0070] The preparation method of the resin matrix and the standard spline is the same as in Example 1.

[0071] Table 1 shows the test results of the epoxy resin composition and its cured product.

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Abstract

The invention relates to a medium-temperature cured prepreg resin matrix for rapid molding and a preparation method of the medium-temperature cured prepreg resin matrix and mainly solves the technicalproblem of relatively low medium-and-low-temperature curing reaction speed of the existing medium-temperature cured prepreg resin matrix. The problem is solved by preferably selecting a curing system, epoxy resin and a toughening agent. The epoxy resin matrix provided by the invention can be cured within 3h at 80 DEG C, can be cured within 15min at 20 DEG C and can be stored at room temperature for more than one month, and the cured resin matrix is high in glass transition temperature and capable of meeting demands of industries such as sporting and leisure products, automobiles and yachts for rapid molding.

Description

technical field [0001] The invention belongs to the technical field of prepreg manufacture, and in particular relates to a medium-temperature curing prepreg resin matrix for rapid prototyping and a preparation method thereof. Background technique [0002] Prepreg is a composition of resin matrix and reinforcing fibers made by impregnating continuous fibers or fabrics with resin matrix under strictly controlled conditions. It is an intermediate material for the production of high-performance composite materials. According to different curing temperatures, hot-melt epoxy prepregs are mainly divided into medium-temperature curing prepregs (curing temperature between 80 and 150°C) and high-temperature curing prepregs (curing temperature above 180°C). High-temperature curing prepregs are mainly used for the production of main load-bearing structural parts for aerospace and military industries and other structural parts that require high temperature resistance, while medium-temper...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/04C08G59/56C08G59/50
CPCC08L63/00C08G59/5073C08G59/56C08L2205/025C08L2205/03C08L63/04
Inventor 张藕生余荣禄温凤姚斌王芳
Owner CHINA PETROLEUM & CHEM CORP
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