Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-layer circuit board installing structure with vibration resistance

A multi-layer circuit board and installation structure technology, applied in the direction of support structure installation, clamping/extracting device, etc., can solve the problems of easy fracture, vibration stress concentration, complex structure, etc., achieve good processability, improve life and reliability The effect of sex and simple structure

Inactive Publication Date: 2018-03-30
WUHAN AVIATION INSTR
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The installation structure has poor anti-vibration performance, and has the following disadvantages: First, since each layer of circuit board components is fastened by pillars, the vibration stress is relatively concentrated, especially if there are circuit board components with large mass and pillars. Tight parts are most likely to break
Second, each layer of circuit boards and pillars has an amplification of the vibration amplitude of the base, which accumulates sequentially. The circuit board farthest from the base has the largest amplification of the vibration amplitude. The circuit board is easy to collide with the shell of the acceleration sensor, reducing the vibration amplitude. The life and reliability of the accelerometer
Third, the installation structure involves a large number of pillars. Due to the limitation of the installation space, the outer diameter of the pillars cannot be very large. In order to install the circuit board and pillars on the next layer, threaded holes must be processed on the pillars, and the structure is more complicated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-layer circuit board installing structure with vibration resistance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be described in further detail below. refer to figure 1 . An anti-vibration structure that ensures that the acceleration sensor is resistant to random vibrations. The structure is composed of a base 7, a pillar 6, a sleeve Ⅰ5, a sleeve Ⅱ4, a sleeve Ш3, a spring washer 2, a nut 1 and a multilayer circuit board assembly. The layer circuit board assembly includes a first layer circuit board 11, a second layer circuit board 10, a third layer circuit board 9 and a fourth layer circuit board 8. The pillar 6 is an integral design, and the lower end is screwed on the base 7. A layer of circuit board 11 is placed on the journal of the pillar 6. On the first layer of circuit board 11, the sleeve I5 is inserted into the pillar 6, and the second layer of circuit board 10 passes through the pillar 6 and is pressed on the sleeve I5. ; On the second-layer circuit board 10, the sleeve II4 is inserted into the pillar 6; the third-layer circuit board 9 passes...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of circuit installation and design, particularly to a multi-layer circuit board installing structure with vibration resistance. The multi-layer circuit board installing structure with vibration resistance can ensure resistance of circuit integral structures to random vibration. Due to the fact that environmental vibration conditions of accelerator sensors are improved from original sinusoidal vibration to random vibration, test level of random vibration is improved from low requirements of an aircraft cabin to high requirements of positions close to an engine. According to the multi-layer circuit board installing structure with vibration resistance, a base is provided with a support column, a first layer of circuit board is installed on the journal of thesupport column, a second layer of circuit board is separated from the first layer of circuit board as well as a plurality of upper layers of circuit boards through sleeves, and a top layer of circuitboard is fixed onto the support column through a nut and a spring washer. The multi-layer circuit board installing structure with vibration resistance prolongs the service life and improves reliability of the accelerator sensor.

Description

technical field [0001] The invention relates to the field of circuit installation and design, and specifically relates to a multi-layer circuit board installation structure with anti-vibration effect, which ensures that the overall structure of the circuit is resistant to random vibration. Background technique [0002] Usually, in order to ensure the accuracy of acceleration measured by the acceleration sensor and eliminate installation errors, the acceleration sensitive core is directly installed on the base, and the acceleration signal processing circuit is installed on the base through a pillar. Since the environmental vibration condition of the acceleration sensor has been improved from the sinusoidal vibration in the past to random vibration, the test value of random vibration has also moved from the low requirement of the aircraft cockpit to the high value close to the engine. Therefore, the anti-vibration performance of the acceleration signal processing circuit direc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/14
CPCH05K7/1407
Inventor 肖岸飞王鲲鹏余志勇
Owner WUHAN AVIATION INSTR
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products