Multi-size chip based COB automatic film sticking machine matched with multiple diaphragms

Abstract

The invention discloses a multi-size chip based COB automatic film sticking machine matched with multiple diaphragms. The multi-size chip based COB automatic film sticking machine matched with the multiple diaphragms comprises a case; the case is provided with a feeding mechanism, a clamp table, a crystal source table, two lens components and a film sticking mechanism; the clamp table is arrangedat the discharge end of the feeding mechanism; the crystal source table and the clamp table are arranged side by side; one lens component is arranged above the clamp table; the other lens component isarranged above the crystal source table; and the film sticking mechanism is installed above the crystal source table through a bracket. The multi-size chip based COB automatic film sticking machine matched with the multiple diaphragms can effectively solve the problem of film sticking of chips in multiple sizes, reduces the film sticking processing time and improves the chip film sticking quality.

Description

technical field [0001] The invention relates to the field of LED film laminating machine equipment, in particular to a COB automatic film laminating machine for simultaneous matching of multi-size chips and multi-diaphragms based on rapid positioning of a visual system. Background technique [0002] With the continuous development of the domestic LED industry, the processing requirements of COB substrates, an important component in LEDs, are getting higher and higher, and their production efficiency and production quality have become one of the important indicators for judging the quality of LEDs. The COB substrate film attachment process is: cut into small pieces of phosphor film, place it on the workbench, heat it to a certain temperature, and place it on the cured or soldered chip. At present, the commonly used film mounter works only for chips of a specific size. When the chip size changes, the matching template information in the system needs to be changed, resulting in...

AI Technical Summary

Problems solved by technology

At present, the commonly used film mounter works only for chips of a specific size. When the chip size changes, the matching template information in the system needs to be changed, resulting in complicated operations, difficulty in meeting the efficiency requirements of different size chip processing, and difficult to guarantee the quality of the film.

[0003] Therefore, in view of the unsatisfactory work efficiency, processing accuracy and reliability of the current domestic film laminating machine, it is urgent to develop a cost-effective, high-speed, high-precision COB substrate laminating machine and realize industrialization

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