Wafer adhesive remover

Abstract

The invention discloses a wafer deglue machine, which comprises a main body, the side of the main body is provided with a workpiece basket feeding port and a discharge port, the front of the main body is provided with a perspective window, and the main body is provided with a cleaning tank and Manipulator device, the manipulator device automatically puts the workpiece flower basket into the cleaning tank for cleaning, and then transfers it to the next cleaning tank for cleaning. The cleaning tank includes the first water tank, ultrasonic drug tank, first ultrasonic rinsing tank, First acid tank, second ultrasonic rinse tank, second acid tank, quick drain rinse tank and second water tank. The invention has good cleaning effect, fast cleaning speed, high cleanliness, no manual contact, safe and reliable, no damage to the surface of the workpiece, improved product performance, service life and reliability, meets the needs of the next processing procedure of the product, improves Improve production efficiency and product appearance quality, and reduce cleaning costs.

Description

technical field [0001] The invention relates to the technical field of cleaning equipment, in particular to a wafer deglue machine. Background technique [0002] Integrated circuit (INTEGRATED CIRCUIT, referred to as IC) is the main product of microelectronics technology. It uses special design technology and special integration process technology to make basic components such as transistors, diodes, resistors, and capacitors that constitute integrated circuits. On an insulating substrate such as an integrated circuit single chip (such as silicon or gallium arsenide) or ceramics, and complete the interconnection between components according to circuit requirements, and then package them in a housing, specific circuit functions or system functions can be completed. Integrated circuits are the cornerstone of electronic information technology. Its development scale and technical level have become an important symbol of a country's status and comprehensive strength. It has not o...

AI Technical Summary

Problems solved by technology

Since this process is the removal of thick glue, for 300mm wafers, the transport of the wafer, the uniformity of the solution, and the accuracy of temperature control all directly affect the removal effect

[0006] At present, the technology of glue removal equipment is backward, bulky, water consumption, power consumption, energy consumption, cleaning is not clean, and the device is easily damaged during the cleaning process.

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