Wafer adhesive remover

Abstract

The invention discloses a wafer adhesive remover. The wafer adhesive remover comprises a body; a workpiece basket material inlet and material outlet are formed in the side surface of the body; a perspective window is formed in the front surface of the body; cleaning tanks and a mechanical arm apparatus are arranged in the body; the mechanical arm apparatus automatically puts a workpiece basket into one cleaning tank for cleaning and then conveys to the next cleaning tank for cleaning; and the cleaning tanks comprise a first water tank, an ultrasonic medicinal tank, a first ultrasonic rinsing tank, a first acid tank, a second ultrasonic rinsing tank, a second acid tank, a quick discharging rinsing tank and a second water tank which are arranged in sequence. The wafer adhesive remover is good in cleaning effect, high in cleaning speed and cleanliness, free of human hand touching, safe and reliable, free of damage to workpiece surfaces, and capable of improving product performance, prolonging service life and improving reliability, satisfying requirement of a next manufacturing procedure of the product, improving production efficiency and appearance quality of the product, and lowering cleaning cost.

Description

technical field [0001] The invention relates to the technical field of cleaning equipment, in particular to a wafer deglue machine. Background technique [0002] Integrated circuit (INTEGRATED CIRCUIT, referred to as IC) is the main product of microelectronics technology. It uses special design technology and special integration process technology to make basic components such as transistors, diodes, resistors, and capacitors that constitute integrated circuits. On an insulating substrate such as an integrated circuit single chip (such as silicon or gallium arsenide) or ceramics, and complete the interconnection between components according to circuit requirements, and then package them in a housing, specific circuit functions or system functions can be completed. Integrated circuits are the cornerstone of electronic information technology. Its development scale and technical level have become an important symbol of a country's status and comprehensive strength. It has not o...

AI Technical Summary

Problems solved by technology

Since this process is the removal of thick glue, for 300mm wafers, the transport of the wafer, the uniformity of the solution, and the accuracy of temperature control all directly affect the removal effect

[0006] At present, the technology of glue removal equipment is backward, bulky, water consumption, power consumption, energy consumption, cleaning is not clean, and the device is easily damaged during the cleaning process.

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