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Temperature control method and device of radio frequency module and computer readable storage medium

A temperature control method and technology of radio frequency modules, applied in the temperature control of radio frequency modules, computer readable storage media field, can solve the problems of multiple temperature margin, sacrifice equipment performance, affect user experience, etc., to achieve temperature and throughput control stable effect

Inactive Publication Date: 2018-03-16
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. The temperature of equipment using this technology can easily end up in an unsteady state
For example, repeated switching between 30% and 50%, resulting in repeated switching of throughput, affecting user experience;
[0008] 2. Need to leave more temperature margin
As shown in the second set of data in Table 1 above, there is a temperature margin of 20 degrees compared with the rated operating temperature, sacrificing part of the performance of the equipment

Method used

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  • Temperature control method and device of radio frequency module and computer readable storage medium
  • Temperature control method and device of radio frequency module and computer readable storage medium
  • Temperature control method and device of radio frequency module and computer readable storage medium

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] see figure 1 , which is a schematic flowchart of a temperature control method for a radio frequency module provided in the first embodiment of the present invention. In this embodiment, the method includes:

[0035] S11, periodically detecting the temperature of the radio frequency module;

[0036] S12. When the temperature of the radio frequency module in the current cycle is greater than a preset first temperature threshold, reduce the duty cycle of...

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Abstract

The embodiment of the invention provides a temperature control method and device of a radio frequency module and a computer storage medium. The temperature control method comprises the steps that temperature of the radio frequency module is periodically detected; when the temperature of the radio frequency module in a current period is greater than a preset first temperature threshold value, the duty ratio of the radio frequency module is reduced; when the temperature of the radio frequency module in the current period is smaller than a preset second temperature threshold value, the duty ratioof the radio frequency module is improved. By adopting the method, the target temperature is controlled between the first temperature threshold value and the second temperature threshold value. Compared with the prior art, temperature and handling capacity control is more stable by adopting the method. In addition, due to the fact that the temperature between the first temperature threshold valueand the second temperature threshold value meets the relation T2 = T1-D1-D2, excessive temperature allowance does not need to be set without sacrifice of part of properties of the device.

Description

technical field [0001] The present invention relates to the technical field of radio frequency modules, in particular to a temperature control method, device and computer-readable storage medium of a radio frequency module. Background technique [0002] The RF module mainly includes RF chips, PA (Power Amplifier, power amplifier), LNA (Low Noise Amplifier, low noise amplifier), RF (radio frequency) switch, antenna, other devices and circuits, etc. Some products include temperature sensors (or other means to obtain Temperature), where PA, LNA, RF switch, etc. can be integrated in a single chip or RF chip, and the temperature sensor can be integrated in the RF chip or PA, or placed near the RF chip or PA as a single device. PA and RF chip are devices that generate high heat. If the temperature of these two devices is too high, it may damage the RF chip or PA, and may also increase the temperature of the housing, other devices and circuits and affect user experience. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/20
CPCG05D23/20
Inventor 王以展雷瑶瑶
Owner TP-LINK
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