Exposure mask and exposure method of using the same
An exposure method and mask technology, which are applied in the fields of photomechanical processing of originals, microlithography exposure equipment, photolithography process exposure devices, etc. Effect
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[0050] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
[0051] figure 1 is a plan view of an exposure mask according to an embodiment of the present invention.
[0052] refer to figure 1 , the exposure mask 10 includes: a normal area NA; a first edge position area PA1 adjacent to one side of the normal area NA; It is adjacent to and has a second edge position area PA2 having the same area as the first edge position area PA1. For example, the exposure mask 10 is in the shape of a rectangle, the first edge position area PA1 and the second edge position area PA2 are spaced apart along the first direction D1 and are respectively along a direction substantially perpendicular to the first direction D1. The second direction D2 extends, and the normal area NA may be formed between the first edge location area PA1 and the second edge location area PA2.
[0053] A pattern for forming an exposu...
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