Annular thermal superconducting pipeline phase change suppression heat sink and electronic product

Abstract

The invention provides an annular thermal superconducting circuit phase change suppression cooling plate and an electronic product, the annular thermal superconducting circuit phase change suppressing cooling plate is a composite plate structure; the surface of the annular thermal superconducting circuit phase change suppressing cooling plate They are all plane, and the surface of the annular thermal superconducting circuit phase change suppression cooling plate is provided with at least one heat source fixed area; the annular thermal superconducting circuit phase change suppression cooling plate is formed with an annular thermal superconducting circuit inside, and the thermal superconducting circuit The conduit line is a closed line, and the thermal superconducting line is filled with heat transfer working fluid. The annular thermal superconducting circuit phase change suppression radiator plate of the present invention has the characteristics of high heat transfer density, high heat transfer rate and good temperature uniformity, so that the heat emitted by the heat source can be quickly diffused and transferred and evenly distributed in the annular heat sink. The phase change of the superconducting circuit is suppressed on the cooling plate, so as to avoid the excessive concentration of heat on the parts near each heat source, resulting in the occurrence of local high temperature situations.

Description

technical field [0001] The invention belongs to the field of phase change suppression heat transfer, in particular to an annular thermal superconducting circuit phase change suppression cooling plate and electronic products. Background technique [0002] With the continuous advancement of electronic technology, the use of various electronic products is becoming more and more frequent. At the same time, with the gradual increase in the power density of electronic components, the arrangement of multiple heat sources in a single electronic circuit will inevitably generate a large number of If the heat is directly dissipated, it will cause heat accumulation near the heat source, causing the local temperature to be too high; in view of this situation, the more common solution is to use a fast heat conduction element with better thermal conductivity (such as : heat pipe) with its local contact with the heat source, and the fast heat conduction element is combined with a heat dissi...

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Problems solved by technology

[0003] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide an annular thermal superconducting circuit phase change suppression heat dissipation plate and electronic products, which are used to solve the local problems of electronic products in the prior art that adopt traditional heat dissipation methods to dissipate heat. overheating problem

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