Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Metal encapsulating structure and preparation method thereof, encapsulating method of display panel and display device

A technology for metal packaging and display panels, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as poor peeling, waste of adhesive film and metal film, and equipment shutdown

Active Publication Date: 2018-03-09
BOE TECH GRP CO LTD +1
View PDF7 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the prior art, due to the good adhesion between the protective film and the adhesive film, it is easy to cause the upper protective film to lift part or all of the adhesive film when peeling off, resulting in poor peeling.
This will not only cause waste of adhesive film and metal film, but also cause abnormal shutdown of equipment and delay in production
As a result, production costs and yields are negatively affected, and capacity improvements are limited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Metal encapsulating structure and preparation method thereof, encapsulating method of display panel and display device
  • Metal encapsulating structure and preparation method thereof, encapsulating method of display panel and display device
  • Metal encapsulating structure and preparation method thereof, encapsulating method of display panel and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as figure 1 As shown, Embodiment 1 of the present invention provides a manufacturing method of a metal packaging structure, and the manufacturing method includes:

[0047] Step S1: providing a metal film, the metal film having a first surface and a second surface opposite to each other;

[0048] Step S2, forming a silane film on the first surface; the surface of the silane film away from the metal film has active groups;

[0049] Step S3, bonding the first surface on which the silane film is formed with the adhesive layer, so that the active groups and the adhesive layer are combined by reaction.

[0050] It should be noted that the specific materials of the above-mentioned metal film and the adhesive layer can use the conventional materials of the metal packaging process in the prior art.

[0051] Among them, since the above-mentioned metal packaging structure is specifically used for surface packaging display substrates, considering that the base substrate of the display s...

Embodiment 2

[0091] Embodiment 2 of the present invention provides a metal package structure formed by the preparation method of the above embodiment 1. The metal package structure includes: a metal film having a first surface and a second surface opposite to each other; The silane film on the surface, the surface of the silane film away from the metal film has active groups (refer to Figure 4 Shown); a glue layer attached to the first surface to which the silane film is attached, the glue layer can react and combine with the above-mentioned active groups to form a covalent bond.

[0092] In this way, the silane film provided on the first surface of the metal film is covalently bonded to the surface of the metal film, so that the silane film can be more firmly attached to the first surface of the metal film. The surface of the silane film away from the metal film is designed to have active groups, and the active groups react with a large number of reactive groups in the dormant state to form ...

Embodiment 3

[0097] Embodiment 3 of the present invention provides a packaging method of a display panel. The packaging method includes: providing the metal packaging structure of any one of the foregoing embodiments 2; and attaching the adhesive layer of the metal packaging structure to the display panel on the side of the adhesive layer away from the metal film. On the panel.

[0098] The above packaging method specifically includes: peeling off the protective film attached to the side of the adhesive layer away from the metal film in the metal packaging structure to expose the side of the adhesive layer away from the metal film; attaching the side of the adhesive layer away from the metal film to the display panel .

[0099] Such as Image 6 As shown, the specific packaging process is: peeling off the protective film 21 under the adhesive layer 20, and attaching it to the first surface of the metal film 10 on which a silane film (not shown in the figure) is formed by a hot pressing process; ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a metal encapsulating structure and a preparation method thereof, an encapsulating method of a display panel and a display device, and relates to the technical field of display.The adhesive force between a metal membrane and a glue layer can be greatly enhanced to prevent a glue membrane from being taken off when a protective membrane on the surface of the glue layer is stripped off, the production cost is reduced, and the production qualification rate is increased. The preparation method includes the steps of providing the metal membrane provided with a first surface and a second surface which are opposite to each other; forming a silicane membrane on the first surface, wherein the surface, away from the metal membrane, of the silicane membrane is provided with active groups; fitting the glue layer with the first surface on which the silicane membrane is formed to make the active groups and the glue layer subjected to an reaction for combination.

Description

Technical field [0001] The invention relates to the field of display technology, in particular to a metal packaging structure and a manufacturing method, a packaging method of a display panel, and a display device. Background technique [0002] As the mainstream packaging technology for large-size OLED (Organic Light-Emitting Display) displays, the surface packaging technology has been widely used in existing production processes. There are mainly two types of existing process routes: [0003] 1. Metal packaging process [0004] That is, the pre-cured adhesive film is used to adhere the metal film and the OLED display panel (or called the backplane), and then the adhesive film is cured through the hot pressing process, so that the entire surface of the OLED display panel is encapsulated by the metal film . [0005] 2. Dam&Filler process [0006] That is, the high-viscosity Dam glue material (dam filling glue) is coated on the frame part of the glass package cover, and Filler (filler)...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L51/52
CPCH10K50/844H10K50/8423H10K50/8426H10K71/00
Inventor 李杰威殷川熊先江齐忠胜屈丽桃
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com