Copper sulfate electroplating solution and preparation method and application thereof and electrolytic cell

Abstract

The invention discloses a copper sulfate electroplating solution and a preparation method and application thereof and an electrolytic cell. The preparation method includes: performing electrolytic reaction in the electrolytic cell, wherein electrolyte for electrolysis is a sulfuric acid aqueous solution which is 1mol / L-3mol / L, and current density of the electrolyte is 9-10ASD; arranging an anode,a cathode, a cation exchange membrane and a proton exchange membrane are arranged in the electrolytic cell. The preparation method is free from a traditional evaporation-recrystallization chemical process, free from discharge of waste gas and wastewater, environment friendly and simple in production process, and the copper sulfate electroplating solution prepared is high in purity, controllable and reliable in quality and applicable to copper interconnecting plating in fields of semiconductor manufacturing and packaging.

Description

technical field [0001] The invention relates to a copper sulfate electroplating solution, its preparation method and application and an electrolytic tank. Background technique [0002] At present, in the integrated circuit process, Damascus copper interconnection technology is widely used. Copper deposition technology is the key technology in Damascus copper interconnection technology. Whether the copper deposited in the micro-groove (hole) is dense, whether there are voids or cracks, directly affects the copper. The resistivity and anti-migration performance of the interconnection wire, and the key semiconductor material to realize the Damascus copper interconnection technology is the high-purity copper sulfate electroplating solution. The purity index of this product is very high, otherwise the reliability of the copper wiring will be affected. At present, most of the methods for producing ultra-clean and high-purity copper interconnect copper sulfate electroplating soluti...

AI Technical Summary

Problems solved by technology

This method has a long process route and high requirements on the quality of raw materials, and the fluctuation of the metal impurity content in the raw materials cannot be controlled. After the reaction, it is necessary to remove H 2 o 2 or HNO 3 , there is waste gas and wastewater discharge, pollutes the environment, and the production cost is high. For the line width design below 65nm, it is difficult to guarantee reliability

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