Computer host box facilitating heat dissipation
A computer and main box technology, applied in the computer field, can solve the problems of reducing the service life of the computer, easily damaged computer components, poor heat dissipation effect, etc., to achieve the effect of convenient maintenance and replacement, firm fixation, and improved heat dissipation effect.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0034] see Figure 1-4, a kind of computer mainframe box that is easy to dissipate heat, comprises box body (1), and the inner wall of box body (1) is fixedly connected with heat sink (2), through the setting of heat sink (2), the upper and lower sides of heat sink (2) The upper cooling box (4) and the lower cooling box (5) are fixedly connected to the cooling pool (8) through the water inlet pipe (11) and the drain pipe (6), and the cooling liquid is circulat...
PUM
![No PUM](https://static-eureka-patsnap-com.libproxy1.nus.edu.sg/ssr/23.2.0/_nuxt/noPUMSmall.5c5f49c7.png)
Abstract
Description
Claims
Application Information
![application no application](https://static-eureka-patsnap-com.libproxy1.nus.edu.sg/ssr/23.2.0/_nuxt/application.06fe782c.png)
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com