Method for improving multi-layer board borehole deviation

A multi-layer board and deviation technology, which is applied in multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., to achieve the effect of preventing precision inaccuracy

Inactive Publication Date: 2018-01-12
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the main reasons for the scrapping of internal short circuit boards is that during the X-RAY target drilling process, layer deviation occurs due to different expansion and contraction values ​​of the boards, resulting in drilling deviation. How to ensure the accuracy of X-RAY drilling targets is to reduce the scrapping of internal shorts focus

Method used

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Examples

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Effect test

Embodiment 1

[0028] The method for improving the drilling deviation of multi-layer boards comprises the following steps:

[0029] S1, X-RAY drilling target, through the inner target, drill the edge positioning hole, and measure the distance of the target hole at the same time to obtain the actual expansion and contraction value;

[0030] S2. Randomly select 5 panels to be processed, measure the actual expansion and contraction data of the panels, and calculate the average expansion and contraction;

[0031] S3, X-RAY multi-layer board drilling target expansion and contraction setting ≤ 75μm, boards that exceed this expansion and contraction need to be stacked and moved;

[0032] S4. The X-RAY layer deviation setting is ≤75μm, separate the riveted bias plate from the normal plate and move the plate to the drill hole, and adjust the drill belt according to the average value of expansion and contraction;

[0033] S5. Use the standard value as the actual shooting distance to carry out line co...

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PUM

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Abstract

The invention relates to a method for improving multi-layer board borehole deviation. The method includes the steps: S1 performing X-RAY target drilling; S2 measuring actual expansion and contractiondata of boards, and calculating an expansion and contraction average value; S3 setting an X-RAY multi-layer board target drilling expansion and contraction range to be lower than or equal to 75 micrometers, and performing board running on the boards exceeding the expansion and contraction range in a pile dividing manner; S4 adjusting a drilling belt according to the expansion and contraction average value; S5 taking a standard value as an actual target drilling distance, and performing wire compensation equidistant target drilling; S6 dividing the boards into different piles, and transferringthe boards to a board edge routing process; S7 routing different number of V-shaped grooves in the board edges; S8 treating the expansion and contraction boards in a pile dividing manner; S9 manufacturing one standard board drilled target; S10 measuring an accuracy error by each target drilling machine per shift every day according to the standard board. According to the method, X-RAY and drillingparameters are strictly controlled, the target drilling machines measure accuracy by the aid of the standard board every day, so that the accuracy of the target drilling machines is within a controllable range, and borehole deviation caused by accuracy misalignment of the target drilling machines is prevented.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a method for improving drilling deviation of multilayer boards. Background technique [0002] At present, the design of printed circuit boards tends to be more and more high-density, which brings many challenges to the manufacture of printed circuit boards, and the difficulty of production is increasing. In the production of PCB multilayer boards, the scrap rate remains high, especially the internal short scrap accounts for a high proportion of various scraps, which brings great pressure to the quality control of multilayer boards, and the scrapping cost of multilayer boards cannot be ignored. Therefore, how to reduce the scrapping rate of the inner layer short circuit is a common concern in the industry. If we want to improve quality, reduce cost, and create higher profits, we must first reduce short-term scrapping. One of the main reasons for the scrapping of internal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46
Inventor 叶志诚蒋善刚周睿
Owner 奥士康精密电路(惠州)有限公司
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