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Special CPU (central processing unit) thermal paste

A technology of thermally conductive adhesives and thermally conductive fillers, applied in the direction of adhesives, adhesive types, amide/imide polymer adhesives, etc., can solve the problems of low thermal conductivity, low stability, high density, etc. Good stability, strong bonding ability and good thermal conductivity

Inactive Publication Date: 2017-12-29
钱小平
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the development of traditional thermal adhesives also encountered some

Method used

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Embodiment Construction

[0010] A kind of thermal conductive adhesive specially for CPU according to the present invention provides a special thermal conductive adhesive for CPU, including modified acrylic resin, water glass, zinc oxide, thermal conductive filler, polyethylene glycol ether and polyacrylamide, and its raw material components By weight, 10-20 parts of the modified acrylic resin, 20-30 parts of water glass, 20-30 parts of zinc oxide, 10-15 parts of thermal conductive filler, 15-20 parts of polyethylene glycol ether, 10 parts of polyacrylamide -18 servings.

[0011] As a preference, the special heat-conducting glue for CPU is characterized in that: its raw material components include 20 parts of modified acrylic resin, 30 parts of water glass, 30 parts of zinc oxide, 15 parts of heat-conducting filler, polyethylene glycol 20 parts of alcohol ether, 18 parts of polyacrylamide.

[0012] As a preference, the special heat-conducting adhesive for CPU is characterized in that: the heat-conduct...

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Abstract

The invention relates to special CPU (central processing unit) thermal paste, made from, by weight, 10-20 parts of modified acrylic resin, 20-30 parts of water glass, 20-30 parts of zinc oxide, 10-15 parts of a thermally conductive filler, 15-20 parts of polyglycol ether, and 10-18 parts of polyacrylamide. The special CPU thermal paste has good thermal conductivity, high binding property, good wear resistance, good resistance to high temperature, good stability, zero toxicity, and environmental friendliness.

Description

technical field [0001] The invention relates to the field of interface heat dissipation materials, in particular to a special heat-conducting adhesive for CPUs. Background technique [0002] With the increasing integration density of microelectronic devices, the heat dissipation requirements of microelectronic devices are also increasing. Therefore, it is of great significance to develop an interface heat dissipation material with high thermal conductivity. Due to its environmental friendliness and low cost, thermal conductive adhesives have gradually replaced traditional tin-lead solder interconnect materials. However, the development of traditional thermal adhesives also encountered some bottlenecks, such as low thermal conductivity, high density, and low stability. Contents of the invention [0003] The technical solution adopted by the present invention to solve the technical problem is to provide a special heat-conducting glue for CPU, which is characterized in that ...

Claims

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Application Information

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IPC IPC(8): C09J133/00C09J171/02C09J133/26C09J11/04
CPCC09J133/00C08K2003/2275C08K2003/2296C08K2201/003C08K2201/011C08L2205/02C08L2205/03C09J11/04C09J171/02C08L71/02C08L33/26C08K3/34C08K3/22C08L33/00
Inventor 钱小平
Owner 钱小平
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