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Split damping cart and damping method

A separate type and material cart technology, applied in the direction of trolleys, multi-axis trolleys, trolley accessories, etc., can solve the problems of inability to take into account the use of light materials, fail to meet the shock absorption requirements, increase production costs, etc., and achieve a significant shock absorption effect , Improve the shock absorption effect and save production cost

Inactive Publication Date: 2017-12-29
CHENGDU ADVANCED POWER SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a separation method for the existing shock-absorbing trolleys that cannot meet the material transportation requirements of light weight and high-precision shock-proof requirements, fail to meet the shock-absorbing requirements, cause material damage, and increase production costs. Type shock-absorbing pusher and shock-absorbing method, the vibration of the wheel of the pusher is eliminated through the elastic pad in the process of being transmitted upward to the frame, and the shock absorption effect is obvious, which effectively solves the problem that standard rubber wheel specifications cannot take into account light materials Disadvantages of use, reduce material damage, save production costs, and the detachable frame also has the advantage of easy disassembly and maintenance

Method used

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  • Split damping cart and damping method
  • Split damping cart and damping method

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Such as Figure 1 to Figure 5 As shown, the separate shock-absorbing push car of this embodiment is used to transport the lead frame products that have been wired in the front section, including the upper frame 1 and the chassis frame 2, and the upper frame and the chassis frame are detachably connected, and The connection structure of the two is a shock-absorbing connection structure 6, and the shock-absorbing connection structure 6 includes an elastic pad arranged between the upper frame 1 and the chassis frame 2, so that the upper frame 1 and the chassis frame 2 are in contact with each other through the elastic pad. .

[0040] Further, the elastic pad in this embodiment is a shock-absorbing silicone pad 601 . The shock-absorbing silicone pad is characterized by both high elastic state and high viscous state. The elasticity of rubber is produced by the change of its coiled molecular conformation. This coiled long-chain molecular structure and the weaker secondary mo...

Embodiment 2

[0043] Such as Figure 1 to Figure 5 As shown, according to the detached shock-absorbing push cart described in Embodiment 1, this embodiment also includes connectors that pass through the elastic pad and are connected to the upper frame 1 and the chassis frame 2 respectively, and the connectors are provided with The elastic sleeve makes the connector contact with the upper frame 1 and the chassis frame 2 respectively through the elastic sleeve. The connecting piece is generally a metal piece. Since the connecting piece will directly contact the chassis frame and the upper frame, in order to further reduce shock, an elastic sleeve is set to cover the connecting piece, and the vibration of the chassis frame received by the connecting piece is eliminated through the elastic sleeve. , to prevent the vibration of the wheel from being transmitted to the upper frame through the connecting piece, and attenuate the energy transmitted from the vibration generated by the wheel to the up...

Embodiment 3

[0047] Such as Figure 1 to Figure 5 As shown, according to the detached shock-absorbing push car described in Embodiment 1 or Embodiment 2, the upper frame 1 of this embodiment includes a support plate 102 for supporting materials, and a stop frame is provided above the support plate 102 Ring 104, a connection pressure plate 101 for connecting with the chassis frame 2 is provided below the support plate 102. A retainer ring is set above the support plate. After placing materials on the support plate, the material can be prevented from falling through the retainer ring, and the structure connecting the upper frame and the chassis frame is set to connect the pressure plate. The plate-like structure is conducive to The elastic pad is placed to increase the elastic damping area.

[0048] Specifically, such as Figure 4 As shown, the support plate 102 is also provided with limit grooves 1021 at intervals, which is convenient for the placement of frame products, and cooperates wi...

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Abstract

The invention discloses semiconductor production auxiliary equipment and relates to a split damping cart. The split damping cart comprises an upper frame and an underframe, the upper frame and the underframe are in detachable connection while connection structures of the upper frame and the underframe are damping connection structures, and the damping connection structures comprise elastic pads between the upper frame and the underframe, so that the upper frame and the underframe contact through the elastic pads. Vibration of wheels under the underframe is eliminated through the elastic pads in a process of transmitting to the upper frame, and direct transmitting of vibration of the underframe to the upper frame is avoided. By placement of transported materials on the upper frame, evident damping effects are achieved, the defect of failure in balancing of standard rubber wheel specifications and lightweight material utilization is effectively overcome, material damages are reduced, production cost is saved, and the detachable frame has the advantage of convenience in demounting and maintenance.

Description

technical field [0001] The invention relates to auxiliary equipment for semiconductor production, in particular to a separate shock-absorbing push car and a shock-absorbing method. Background technique [0002] With the application of automatic production equipment for semiconductor chips, the production efficiency of chips has been greatly improved, but in a highly automated semiconductor workshop, some product transfer and storage processes still need to be completed manually. [0003] For example, the lead frame products that have been wired in the previous section, because the thickness of the frame is only 0.1mm, is very soft, and it needs to be very careful during the transfer and transportation process. The vibration generated by the frame often causes the lead frame installed in the magazine box to collapse, and then Cause the product to be scrapped and increase the cost of use. [0004] The reason is that the existing cart design is directly spliced ​​with stainles...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B62B3/02B62B5/00B62B5/06F16F15/08
CPCB62B3/02B62B5/0006B62B5/06F16F15/08
Inventor 邓海涛宋文段之刚王利华
Owner CHENGDU ADVANCED POWER SEMICON
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