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A periodic pulse thermal imaging detection method for debonding defects in lead-steel multilayer materials

A multi-layer material, periodic pulse technology, applied in material defect testing and other directions, can solve the problems of long detection time, high hardware cost, complex phase-locked modulation system, etc., to achieve low hardware cost, simple equipment, and improved signal resolution. Effect

Active Publication Date: 2019-08-20
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing modulation mode has phase-locked modulation, but the phase-locked modulation system is complicated, the hardware cost is high, and the detection time is long in order to achieve a steady state condition

Method used

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  • A periodic pulse thermal imaging detection method for debonding defects in lead-steel multilayer materials
  • A periodic pulse thermal imaging detection method for debonding defects in lead-steel multilayer materials
  • A periodic pulse thermal imaging detection method for debonding defects in lead-steel multilayer materials

Examples

Experimental program
Comparison scheme
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Embodiment

[0048] figure 1 Is the block diagram of the periodic pulse thermal imaging system.

[0049] In this example, if figure 1 As shown, the specimen is excited by periodic pulses, and according to the principle of thermal wave conduction, the surface will produce a temperature sequence of periodic changes. The change of surface temperature with time can be expressed as a superposition of two parts: a steady state part and a transient part. Solve the transient distribution of surface temperature T(0,t) according to the principle of thermal wave conduction T and the steady-state distribution T(0,t) S ,as follows:

[0050] T(0,t) T =T am +ΔT(1-e -t / τ )

[0051]

[0052] Since the principle of linear superposition is satisfied, the surface temperature change curve with time is as follows:

[0053] T(0,t)=T(0,t) T +T(0,t) S (5)

[0054] Among them, T(0,t) is the change of surface temperature with time. A is the magnitude of the transient component, q 0 is the total ene...

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Abstract

The invention discloses a periodic pulse thermal imaging detection method for debonding defects of lead-steel multilayer materials. The tested piece is excited by the periodic pulse, and the thermal image sequence of the surface temperature of the tested piece containing defect information changing with time is obtained, and then Perform Fourier expansion on the thermal image sequence to become a superposition of multiple sinusoidal signals. According to the thermal wave principle, the thermal response of each corresponding sinusoidal signal can be obtained, so as to obtain the thermal response of the periodic pulse, so that the energy can be increased at the same time. Control the maximum temperature rise, improve the detection depth, increase the signal resolution, and improve the detectable rate of deep defects and shallow micro defects.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing, and more specifically relates to a periodic pulse thermal imaging detection method for debonding defects of lead-steel multilayer materials. Background technique [0002] Non-destructive testing technology is the key technology to ensure the manufacturing quality and operation safety of major engineering equipment. Lead-steel multilayer bonding materials have been widely cited in the field of nuclear industry due to their special structure and properties. Due to the influence of production technology and environmental factors, lead-steel multilayer materials are prone to defects such as poor bonding, pores, and local debonding, which destroys the structural integrity and also poses a huge potential safety hazard. Multilayer materials pose challenges to most nondestructive testing techniques due to their complex structures, commonly possessed thicknesses, diversity of material pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/72
Inventor 高斌李晓希汤光平李建文孙朝明
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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