Microwave device and assembly method thereof

Abstract

The invention discloses a microwave device and an assembly method thereof, and relates to the technical field of electronic components. The microwave device comprises a box body, and is characterized in that the internal part of the box body is fixedly provided with a PCB, the surface, which is connected with the box body, of the PCB is provided with an insulating dielectric layer, the upper surface of the insulating dielectric layer is provided with a PCB pattern, the insulating dielectric layer is provided with a plurality of through holes penetrating the upper and lower surface of the insulating dielectric layer, the side wall of each through hole is provided with a metallized layer, the space enclosed by the metalized layer in each through hole is filled with resin, the metalized layer and the resin form a bonding pad structure, a chip is fixed at the upper surface of the bonding pad, the back surface of the chip is connected with the box body through the metalized layer, and a wiring terminal of the chip is connected with the PCB pattern through a gold bonding wire. The microwave device has the advantages of small spacing between strip lines, low cost, no stress transition, simple assembly and high efficiency.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a microwave device and an assembly method thereof. Background technique [0002] At present, in order to reduce production costs and improve manufacturability, electronic equipment and devices are developing towards multi-chip integration. Multi-chip assembly technology has higher and higher requirements for assembly process. For compact module and component-level products, especially in the millimeter wave field, the existing low-cost, mass-produced technical means are still lacking, or it is difficult to assemble and the assembly efficiency is low (gold-plated gaskets are used after digging grooves), or Expensive (LTCC), or long design and processing cycle (multilayer substrate). Contents of the invention [0003] The technical problem to be solved by the present invention is how to provide a microwave device with small stripline spacing, low cost, no need for...

AI Technical Summary

Problems solved by technology

For compact module and component-level products, especially in the millimeter wave field, the existing low-cost, mass-produced technical means are still lacking, or it is difficult to assemble and the assembly efficiency is low (gold-plated gaskets are used after digging grooves), or Expensive (LTCC), or long design and processing cycles (multilayer substrates)

Images