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Multi-chip white LED package structure

A LED packaging, multi-chip technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of incomplete light mixing, chips cannot be overlapped, mixed into white light, etc.

Pending Publication Date: 2017-12-15
深圳市英唐智能控制股份有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

It can effectively solve the problem that the light-emitting areas cannot overlap due to the inability of the chips to overlap in space, and there are areas with incomplete light mixing, which cannot completely mix white light.

Method used

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  • Multi-chip white LED package structure

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Embodiment approach

[0020] The structural implementation of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0021] Such as figure 1 - figure 2 A first embodiment of the present invention is shown. A multi-chip white light LED packaging structure. It includes a bracket 14, a first light-emitting chip 12 installed in the bracket 14, a second light-emitting chip 11, a third light-emitting chip 13, a plurality of pads, and an encapsulant 15 for packaging each light-emitting chip in the bracket 14. The encapsulation glue 15 is preferably epoxy resin, the first light-emitting chip 12 is arranged on a pad, the second light-emitting chip 11 and the third light-emitting chip 13 are connected in parallel or in series and are arranged on their respective pads, the above three kinds of light-emitting chips are respectively Electrically connected to the respective pads, the encapsulation glue 15 encapsulates the three kinds of light-emitting...

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Abstract

The invention discloses a multi-chip white LED package structure, which comprises a bracket; a first light-emitting chip, a second light-emitting chip, a third light-emitting chip which are installed in the bracket; a plurality of bonding pads; and a packaging glue packaging each of the light-emitting chips in the bracket. The packaging glue is preferably an epoxy resin. The first light-emitting chip is disposed on one bonding pad. The second light-emitting chip and the third light-emitting chip are connected in parallel or in series and are disposed on the respective bonding pads. The three light-emitting chips are electrically connected to the respective bonding pads respectively. The three light-emitting chips are packaged in the bracket by the packaging glue. A plurality of solid particles or / and a plurality of material mixtures are arranged in the packaging adhesive encapsulation glue. The solid particles have the function of refraction or reflection or penetration. The material mixtures are formed by mixing a plurality of materials with different refractive indexes. The multi-chip white LED package structure has the characteristics of reasonable design, simple structure, safe and reliable work, and so forth; and can effectively solve the problem that the white light cannot be completely mixed due to the failure of the chips to overlap in space and the resulting presence of areas where the light mixing is not complete.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and relates to a multi-chip white LED packaging structure. Background technique [0002] LED (light-emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not only required to be able to protect the wick, but also to be able to transmit light. Therefore, LED packaging has special requirements for packaging materials. LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Generally, the die of a discrete device is sealed in a package structure, and the function of the package is mainly to protect the die and complete electrical interconnection. The LED packaging is to complete the output of electrical signals, protect the normal operation of the die, and output: the function of visible light. It ...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/58H01L33/60H01L33/62H01L33/64
CPCH01L25/0753H01L33/48H01L33/58H01L33/60H01L33/62H01L33/642
Inventor 林文斌
Owner 深圳市英唐智能控制股份有限公司
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