Non-outwards-protruding packaging metal outer shell side wall horizontal insulator brazing method
A metal shell and brazing method technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of complex type and use, difficulty in fixing, and difficulty in fixing solder, and achieve the effect of enhanced versatility
Active Publication Date: 2017-12-05
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Problems solved by technology
However, it is difficult to place the Ag-Cu solder when welding this side wall insulator, because it is necessary to ensure that the solder flows into the gap, and it is also necessary to prevent it from climbing up on the lead wire of the insulator and causing its size to change, and the solder is difficult to fix from the side
In addition, if a special mold is used for positioning, due to the difference in the height of the shell and the height of the chip, the type and use of the mold are more complicated, which is not conducive to mass production
During the brazing process, the insulator will slide to a certain extent in the hole, and it is difficult to achieve no convexity without special methods.
Method used
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Abstract
The invention discloses a non-outwards-protruding packaging metal outer shell side wall horizontal insulator brazing method and used for fixing welding materials in packaging and assembling and ensuring no outwards-protruding of post-welded insulator. Main components comprises a molybdenum sheet clip adapting a high temperature welding environment, a squareceramic chip with an opening hole in the middleclosely attached to the inner wall for preventing an insulator protruding and an annular ceramic chip used for fixing the welding materials and preventing the insulator protruding outwards. The non-outwards-protruding packaging metal outer shell side wall horizontal insulator brazing method comprises the following steps that (1) the center of the opening hole of the square ceramic chip is inserted intoa metal wall and abutsagainst the metal wall along a lead wire of the insulator during installing; (2) a sandwich-like structure of the square ceramic chip / the insulator / the welding materials / the annular ceramic chip is formed; and (3) the ceramic chips are adjusted by using a pair of tweezers, so that the ceramic chips are attached to the metal wall or the welding materials, the annular ceramic chip and the welding materials are dialed to be placed in the middle relative to the lead wire of the insulator, and fixing of the welding materials is achieved. The non-outwards-protruding packaging metal outer shell side wall horizontal insulator brazing method has the advantages that high generality is achieved, the ceramic chips and the molybdenum sheet clip can bear high temperature and can be used repeatedly, the cost is low, and the failure rate ofa pipe outer shell due to the protruding of insulator can be controlled to be within 2%.
Description
A brazing method for horizontal insulators on the side walls of packaged metal shells without protruding technical field The invention relates to a method for brazing horizontal insulators on the side walls of packaged metal shells that does not protrude. It is specially formulated to realize the flat welding of horizontal insulators on the side walls of metal shells in packages, and belongs to the technical field of electronic package shell manufacturing. Background technique One of the typical features of the glass-metal wall package is the use of coaxial input and output terminals, which have small microwave transmission loss and voltage standing wave ratio. Due to the good microwave performance and manufacturability of this type of casing, it is widely used in various fields such as communication and equipment manufacturing. In order to ensure the coaxial transmission performance, the current method of manufacturing this type of housing is mainly to process the input a...
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Patent Type & Authority Applications(China)
IPC IPC(8): B23K31/02
CPCB23K31/02
Inventor 申忠科董一鸣戴洲梁正苗
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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