Packaged product fall simulation analysis method

A simulation analysis and packaging technology, which is applied in design optimization/simulation, special data processing applications, instruments, etc., can solve the problem of rough evaluation methods, low portability, and inability to accurately predict the cushioning performance of packaging structures, product impact strength, etc. problem, to achieve the effect of good product structure design optimization and good packaging scheme optimization

Inactive Publication Date: 2017-12-01
四川长虹空调有限公司
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AI Technical Summary

Problems solved by technology

At present, the accuracy of the drop simulation results of packaged products is generally based on whether the deformation parts of the simulation results are consistent with the experimental deformation parts. If the simulation results are inconsistent with the experiments, the packaging material parameters need to be modified until the simulation results are consistent with Until the experimental results are consistent, and this kind of judgment method is too rough, there is no intuitive data consideration and comparison, and the simulation parameters of the packaging material corrected by the experimental results may not be able to truly reflect its force state during the drop process, so after correction The packaging material parameters have low portability in the subsequent drop simulation, and cannot accurately predict the cushioning performance of the packaging structure and the impact strength of the product in the conceptual design stage

Method used

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  • Packaged product fall simulation analysis method
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  • Packaged product fall simulation analysis method

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Embodiment Construction

[0024] The technical solution of the present invention is described in detail below in conjunction with accompanying drawing and specific embodiment:

[0025] The invention verifies the accuracy and reliability of the packaged product drop simulation results based on the acceleration data of the drop test and the deformed part of the product after the drop, and the results calculated according to the simulation method can provide a basis for product and package structure design or improvement.

[0026] First, if figure 2 As shown, use the drop test bench 1, data acquisition instrument 4 and PC5 to collect the drop impact acceleration data of the packaged air conditioner 2 under different working conditions, and arrange at least three acceleration sensors 3 on the packaged air conditioner 2, and the data acquisition instrument The sampling frequency is set to 1KHz, and the drop impact acceleration data of the packaged air conditioner is collected to obtain the acceleration cur...

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Abstract

The invention relates to the field of fall simulation analysis, and discloses a packaged product fall simulation analysis method, solving a problem of packaged product fall simulation analysis. The method comprises the steps of collecting fall impact acceleration data of each test point on a product; performing intervention repair on a virtual 3D model sample, meshing the repaired model, and outputting a calculation K file; editing the calculation K file; performing fall simulation calculation according to the calculation K file, so as to obtain acceleration of a test point of a bottom board and a dynamic stress strain field distribution cloud chart of each part; and determining simulation accuracy according to a comparison result of actual acceleration data and acceleration of simulation calculation, and if the simulation is accurate, evaluating the fall anti-impact strength of each part according to the stress strain cloud chart of simulation calculation and an effective plastic strain indicator. The method is applicable to packaged air conditioner.

Description

technical field [0001] The invention relates to the field of drop simulation analysis, in particular to a drop simulation analysis method for packaged products. Background technique [0002] Household appliances such as air conditioners often fall during transportation and handling, so higher requirements are placed on the reliability of product packaging and the impact strength of products. The drop test is an intuitive means to verify the reliability of product packaging and product impact strength, but the cost of the test is high and the test period is long. Solving the problem by rectifying the packaging structure and increasing the packaging cost is in the stage of verification while rectifying; the drop simulation technology can solve the above problems, and can provide a basis for product strength design in the conceptual design stage and shorten the product development cycle. [0003] The accuracy of the drop simulation of packaged products mainly depends on the fo...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/20G06F30/23
Inventor 李磊鑫李越峰董维夏培均
Owner 四川长虹空调有限公司
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