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Micromechanical sensor and method for producing a micromechanical sensor

A micro-mechanical and sensor technology, applied in the field of manufacturing micro-mechanical sensors, can solve problems such as unsatisfactory, achieve the effect of reducing electrostatic force, reducing electrostatic force, and improving sensitivity and resilience

Active Publication Date: 2017-12-01
ROBERT BOSCH GMBH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] - not satisfied

Method used

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  • Micromechanical sensor and method for producing a micromechanical sensor
  • Micromechanical sensor and method for producing a micromechanical sensor
  • Micromechanical sensor and method for producing a micromechanical sensor

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Embodiment Construction

[0046] The core of the invention is the use of masses for micromechanical sensors (such as z-acceleration sensors, lateral acceleration sensors, rotational rate sensors, etc.) that are not perforated (or only weakly perforated) at least in sections , in which, unlike known micromechanical sensors, the distance to the underlying layer (for example the base body) in the region of the mass is significantly increased. Due to the increased spacing compared to the prior art, electrostatic interactions with underlying layers can be minimized and, moreover, the extrusion film damping in the region of the additional mass does not compare to lateral The damping of the sensor is designed disproportionately high. The non-perforated additional mass is advantageously combined with a fully differential electrode arrangement of the isometric rod in order to achieve its low susceptibility to bending relative to the base body and its high capacitance density (effective capacitance per unit area...

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Abstract

A micromechanical sensor (100) is provided. The surface-micromechanically manufactured micromechanical sensor (100) includes at least one mass element formed in a third functional layer (60) and configured in a non-perforated manner at least in certain portions. A gap (S) below the mass element is formed by removal of a second functional layer (30) and at least one oxide layer (20). The removal of the at least one oxide layer (20) takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer (60).

Description

technical field [0001] The invention relates to a micromechanical sensor. The invention also relates to a method for producing a micromechanical sensor. Background technique [0002] Micromechanical inertial sensors for measuring acceleration and rotational rate are produced in mass production for various applications in the automotive and consumer sectors. For capacitive acceleration sensors with a detection direction (z-direction) perpendicular to the wafer plane, an isometric rod is preferably used. The sensor principle of these isometric rods is based on a spring-mass system, in which, in the simplest case, two plate capacitors are formed with two movable excitation masses fastened to counter electrodes of the base body. The vibration-exciting mass is connected to the pad through a torsion spring. If the mass structure on the two sides of the torsion spring is of different size, the mass structure is rotated relative to the torsion spring as the axis of rotation under...

Claims

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Application Information

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IPC IPC(8): G01P15/125
CPCG01P15/125B81C1/00476G01C19/56G01C19/5656G01P1/003G01P15/0802B81B2201/025G01P2015/0814G01P2015/0831G01P2015/0834G01P2015/0837B81B3/0008B81B2201/0235B81B2201/0242B81B2203/0181B81B2203/0338B81C1/00174B81C2201/0132G01C19/5712
Inventor B.P.赫措根拉特J.克拉森
Owner ROBERT BOSCH GMBH
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