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Optical fingerprint sensor module and manufacturing method thereof

A technology of a fingerprint sensor and a manufacturing method, applied in the directions of instruments, character and pattern recognition, computer parts, etc., can solve the problems of complex manufacturing method steps, high cost, low efficiency, etc., and achieve easy control, improve yield, reduce cost effect

Inactive Publication Date: 2017-11-17
SHANGHAI OXI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The structure of the existing optical fingerprint sensor module needs to be improved, and the manufacturing method of the existing optical fingerprint sensor module has complicated steps, low efficiency and high cost

Method used

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  • Optical fingerprint sensor module and manufacturing method thereof
  • Optical fingerprint sensor module and manufacturing method thereof
  • Optical fingerprint sensor module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] A manufacturing method of an existing optical fingerprint sensor module is as follows: Figure 2 to Figure 6 shown.

[0043] refer to figure 2 , provide a glass substrate 200, the glass substrate 200 includes a plurality of undivided sub-substrates 210, that is, the sub-substrate 210 is a part of the glass substrate 200 (the glass substrate 200 includes all the sub-substrates 210 and other sub-substrates 210 between the sub-substrates 210 part).

[0044] continue to refer figure 2 , fabricate the circuit block (not shown) of the optical fingerprint sensor on the surface of each sub-substrate 210 . One circuit block is fabricated on the surface of a sub-substrate 210 , that is, multiple independent circuit blocks are fabricated on the surface of the glass substrate 200 .

[0045] Please refer to image 3 , cutting the glass substrate 200 on which the circuit block is fabricated, and cutting into each sub-substrate 210 with the circuit block. Then, various binding...

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Abstract

The present invention provides an optical fingerprint sensor module and a manufacturing method thereof. The optical fingerprint sensor module comprises a first sub substrate having a first surface and a second surface; a second sub substrate having a third surface and a fourth surface; a circuit board located at the second surface, wherein the circuit has a photosensitive pixel area which comprises a transparent area; a color block or a color sublayer located at the third surface, wherein the first sub substrate and the second sub substrate are pasted together in para position, when the third surface has the color block, the photosensitive pixel area and the color block are opposite, when the third surface has the color sublayer, the photosensitive pixel area and the color sublayer are opposite; and a transmission medium located between the photosensitive pixel area and the color block or located between the photosensitive pixel area and the color sublayer. The optical fingerprint sensor module is optimized in structure and improved in performance.

Description

technical field [0001] The invention relates to the field of optical fingerprint identification, in particular to an optical fingerprint sensor module and a manufacturing method thereof. Background technique [0002] Fingerprint imaging recognition technology is to collect the fingerprint image of the human body through the optical fingerprint sensor, and then compare it with the existing fingerprint imaging information in the system to judge whether it is correct or not, and then realize the technology of identity recognition. Due to its ease of use and the uniqueness of human fingerprints, fingerprint imaging recognition technology has been widely used in various fields. For example, security inspection areas such as public security bureaus and customs, building access control systems, and consumer products such as personal computers and mobile phones, etc. The realization of fingerprint imaging recognition technology includes optical imaging, capacitive imaging, ultrason...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1324
Inventor 凌严朱虹
Owner SHANGHAI OXI TECH
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